Static Shielding Bag <50V Low Charging Dissipative Anti-Static Packaging for IC Chips Semiconductors

Name: Static Shielding Bag <50V Low Charging Dissipative Anti-Static Packaging for IC Chips Semiconductors
Brand: Shenzhen Xunlan Technology Co., Ltd.
SKU: 2121703525

Guangdong, ChinaShenzhen Xunlan Technology Co., Ltd.

US$0.081-0.90

10,000 Pieces

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Seams

2 or 3 Sealing Sides

Anti-Static Value

10^6-10^11 Omega

Model NO.

1-0408

Transparency

Translucent

Surface Resistance

10^6-10^11 Omega

Inner Layer Resistance

10^6-10^11 Omega

Conventional Thickness

0.075~0.2 mm

Water Vapor Transmission Rate (Wvtr)

Less Than or Equal to 0.31 G /M 2.24 H

Test Method

ASTM F1249-13, ASTM D3985-2005(2010)E1

Design

Certification

RoHS, ISO

Condition

New

Type

Antistatic Agents

Waterproof

Anti-Static, Waterproof, Light Shield

Material

APET/CPP or APET/PE

Usage

Electrical Components

Transport Package

Cartons

Specification

Customized Size

Trademark

Xunlan

Origin

China

HS Code

3923290000

Production Capacity

100000PCS/Day

Company profile

Shenzhen Xunlan Technology Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2010-04-10Nearest Port: Shenzhen nanshan shekou port., Shenzhen yantian shekou port.Average Response Time: ≤2.08hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW, CIF, CIP

About Our Factory & Business Background

Address2nd Floor, Building 1, Fuzhen Industrial Park, Yutang Street, Guangming District, Shenzhenguangdong P. R. China 518105, Shenzhen, Guangdong, China

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsBubble Malier, Corrugated Padded Envelope, Padded Shipping Envelope, Honeycomb Paper Envelope, ESD Bag, Aluminum Foil Bags, Thermal & Insulation, Carton Box, Vacuum Pouch Bag, Conductive Bag