Photo Etched Stamped Power Transistor Copper Lead Frame Packaging

Low cost & high flexibility : Low mould cost, short template production cycle, and flexible design changes, making it ideal for rapid development.

High precision & no deformation: No burrs, no pressure marks, no product deformation; accuracy increases with thinner materials, and half-etching for fine details is achievable.

Wide applicability: Compatible with almost all metals, handles both thick and thin materials equally, and can produce complex shapes and miniaturized parts.