Low Inductance & Impedance: Parallel distribution of plates reduces line inductance and impedance, improving high current capacity.
EMI & Noise Reduction: Effectively reduces system noise, EMI, and RF interference for stable operation.
Compact Space Saving: Compact multi-layer structure saves internal installation space and increases heat dissipation area.
High Reliability: Reduces surge voltage and component damage, prolonging the service life of electronic parts.
Fast Modular Assembly: High power modular connection structure allows for simple and fast assembly.
Wide Application Scope: Suitable for rail transit, wind/solar inverters, industrial inverters, and large UPS systems.
RoHS CE ISO Certified: Products meet RoHS, CE, and ISO9001 certification standards for quality assurance.
Tin Plated Surface: Surface treatment is tin plated to enhance conductivity and corrosion resistance.