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BGA221 Emcp 11.5X13mm Reballing Stencil Kit for IC Chip
US$95.70
1-9 Pieces
US$90.90
10-19 Pieces
US$86.40
20+ Pieces

Product profile

Application

Mobile Phone, Integrated IC

Environmental Protection

General

Connection Mode

Na

Model NO.

705-0000340

Shape

Rectangle

Contact Termination Form

Welding Connection

Type

High Temperature Electric Connector

Character

High Temperature Resistance

Production Process

Welding

Interface Type

No

Brand

Sireda

Pin Count

221

Pitch

0.5mm

Contact

Pogo Pin

Package

BGA

IC Size

11.5X13mm

Payment Term

EXW

Payment Method

100% T/T in Advance

Transportation

FedEx/UPS/DHL Acceptable

Transport Package

Carton

Specification

BGA221

Trademark

Sireda

Origin

Shenzhen, China

Company profile

Business Type: Manufacturer/Factory

Send Inquiry

*To:Sireda Technology Co., Ltd.Sireda Technology Co., Ltd.
*Content:
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