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Emmc BGA153 Mobile Phone IC Reballing Tool Kit for Chipset
US$96.66
1-9 Pieces
US$94.77
10-49 Pieces
US$92.91
50+ Pieces

Product profile

Application

PCB, Computer, Communication, Mobile Phone, Integrated IC

Environmental Protection

General

Connection Mode

Card Lock Connection

Model NO.

705-0001164

Shape

Rectangle

Contact Termination Form

Screws Fixed

Type

Reballing Kit

Character

High Temperature Resistance

Production Process

CNC

Interface Type

N/a

Brand

Sireda

Package

BGA153

Pitch Size

0.5mm

IC Size

11.5X13X0.8mm

Material of Solder Kit

Al

BGA Reballing Service

Acceptable

Color

Red & Black

Certifacte

ISO9001

Keyword

BGA Reballing Stencil

Transport Package

Carton

Specification

80*80mm

Trademark

Sireda

Origin

Shenzhen, China

Company profile

Business Type: Manufacturer/Factory

Send Inquiry

*To:Sireda Technology Co., Ltd.Sireda Technology Co., Ltd.
*Content:
0/4000

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