True 3D Inspection Performance: Provides reliable solutions for false alarms, leaks, and difficult measurement environments with high materials.
IPC-610 Compliant Detection: Delivers test result values strictly according to IPC-610 standards for solder joints and component inspection.
AI-Driven Automatic Programming: KAP technology uses 3D measurement data to recommend detection conditions, significantly reducing operator programming time.
Real-Time Process Optimization: KPO solution uses Deep Learning to analyze root causes of defects and optimize surface mount technology production.
Comprehensive Defect Detection: Detects missed welding, offset, polarity, flipped parts, OCV/OCR, and various solder joint issues with high precision.
Whole Board Foreign Object Detection: Capable of identifying foreign objects and slight warping across the entire board surface.
Minor Customization Available: Offers customization options from samples, designs, and minor adjustments to meet specific needs.