Lifetime Warranty Coverage: Covers all mechanical defects with free parts and labor for the machine's entire life.
Advanced Defect Detection: Detects cracks, black spots, mixed wafers, process defects, and cold solder joints.
High Resolution Imaging: 4928*3264 resolution captures microcracks and finger defects invisible to the eye.
Flexible Module Testing: Tests framed or unframed modules before or after lamination with sample size up to 2200mm.
Automated Software Features: Barcode scanning, automatic file naming, and defect classification with image saving.
Improved Production Yield: Identifies defective modules before lamination to improve line yield and final product quality.
Offline Operation Mode: Runs in offline mode for maximum flexibility and efficiency in production lines.
Comprehensive Configuration: Includes testing host, computer, and specialized software for complete operation.