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Product profile
Application
LaptopType
HeatpipeHeatsink Material
CopperModel NO.
HP0081CPU Type
AllFinish
Nickel or Anti-OxidationTransport Package
Plastic Bag + CartonSpecification
3-16 mm wideTrademark
SDM or OEMOrigin
ChinaProduction Capacity
200000 PCS/DayCompany profile
Shenzhen Soodeco Thermal Engineering LimitedGuangdong, China
Business Type: Manufacturer/FactoryExport Year: 2005-04-08Nearest Port: ShenzhenAverage Response Time: ≤5.31hTerms of Payment: LC, T/TInternational Commercial Terms(Incoterms): FOB, CIF, EXW
About Our Factory & Business Background
AddressB407, Building 13g, Xiacun 2nd Industrial Zone, Gongming, Guangming District, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: 1-3 months Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsHeat Sinks, Liquid Cooling Plate, Copper Sintered Heat Pipe, Aluminum Forging, Aluminum Satmping, Brass Forging, CNC Machinining, Copper Forging / Stamping
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Western Europe
Send Inquiry
*To:Shenzhen Soodeco Thermal Engineering Limited
Shenzhen Soodeco Thermal Engineering Limited*Content:
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