Plastic UHF RFID Card with ISO 18000-6 Protocol for Efficient Access Control (A271)

Name: Plastic UHF RFID Card with ISO 18000-6 Protocol for Efficient Access Control (A271)
Brand: Shanghai Star Trend Enterprise Co., Ltd.
SKU: 2141478875

Shanghai, ChinaShanghai Star Trend Enterprise Co., Ltd.

US$0.15

500-999 Pieces

US$0.12

1,000-9,999 Pieces

US$0.085

10,000+ Pieces

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Function

Identification, Payment, Encrypt/Decrypt, Information, Key Management

Type

Smart Card

Model NO.

A271

Material

PVC

Read-Write Method

Non-Contact Type

Label Category

Passive

Structure

Read-Write Card

Application Field

Market

Power Supply Mode

Passive Card

Frequency

High Frequency

Data Transmission Mode

Parallel

RF Protocol

ISO 14443A/ISO 15693/ISO18000-6

Compatibility

RFID and NFC Compatible

Security Feature

Encryption Available

Chip Available

Lf/Hf/UHF, Em4100/T5577/13.56mhzchip/U8/U9 etc.

Read Range

Short Range to Long Range

Application

Asset Tracking, Attendance, Inventory Management

Form Factor

Card, Tag, Adhesive Sticker, Key Fob, Wristband

Printing

Offset and Screen Process

Personalization Available

Chip Encoding/Numbers Printing

Customizable Feature

Custom Logo and Color

Transport Package

Air, Ocean, Express

Specification

CR80. Customized sizes available

Trademark

OEM

Origin

Shanghai, China

HS Code

85235210

Production Capacity

60 Millions/Year

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceYears of Export ExperienceCustomization from Designs

Shanghai Star Trend Enterprise Co., Ltd.

Shanghai, China

Business Type: Manufacturer/FactoryExport Year: 2001-01-08Nearest Port: ShanghaiAverage Response Time: ≤18hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, CFR, CIF, DDP, CPT, EXW

AI-Powered supplier vetting

SummaryShanghai Star Trend Enterprise Co., Ltd. is identified across the slices as a China-based limited company operating in Shanghai, with conflicting classifications as both a trading company and a manufacturer/factory. It has in-stock capability, self-operated import/export rights, 90% export sales, and access to Shanghai port, but no overseas warehouse, showroom, agents, or branches. The supplier supports customization from samples and designs, while its R&D profile is limited: one R&D engineer, no new products in the past year, no ODM, SDK, or 3D software design services. Complaint handling and corrective/preventive action procedures have records, but quality assurance, raw-material traceability, fire-drill status, and environmental-assessment status are not established in the provided information. Financial credibility and customer-case evidence cannot be adequately assessed because the relevant slices provide only years rather than substantive performance data, and no financial figures are reported.

After-Sales capabilityThe supplier has a documented and followed procedure for handling customer complaints, and its company description references after-sales service. However, it has no overseas agents or branches, overseas warehouse, or showroom, which may limit local support infrastructure.

R&D capabilityInnovation evidence is limited: the supplier has one R&D engineer, launched no new products in the past year, does not provide ODM, SDK, or 3D software design services, and is not identified as a professional technical supplier. These stated limitations indicate weak innovation capability for technology-led development.

Production capacityThe supplier reports three card manufacturing facilities around Shanghai, in-stock service capability, self-operated import/export rights, 90% export sales, and proximity to Shanghai port. However, outsourcing procedures and manufacturing contracts are marked unknown, so the full production-control system cannot be confirmed.

Customization capabilityThe supplier explicitly provides customization from samples and from customer designs. This supports product customization, although the records do not establish broader engineering, 3D software, ODM, or SDK capability.