Preprinted PVC Gift Cards with Hot Stamping or UV Coating (A122)

Name: Preprinted PVC Gift Cards with Hot Stamping or UV Coating (A122)
Brand: Shanghai Star Trend Enterprise Co., Ltd.
SKU: 849323475

Shanghai, ChinaShanghai Star Trend Enterprise Co., Ltd.

US$0.10

500-999 Pieces

US$0.07

1,000-9,999 Pieces

US$0.036

10,000+ Pieces

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Structure

Printing Card

Pinting

4 Color Process, Spot Printing, CMYK, Laser Printing, Ink Jet, Digital Printing, Silk Screen Printing, Offset

Model NO.

ST-Card-A122

Read-Write Method

RFID

Material

PVC

Application

Project Use

Transparency

Opaque Card

Size

Standard Cr80, 85.60 mm X 53.98 mm

Thickness

Typically 30 Mils (0.76 mm)

Customized Styles

Available Upon of Negotiation

Chip Integration

Optional, Can Include Smart Card Chips

RFID/NFC Capability

Optional, for Contactless Communication

Available Chips

Lf/Hf/UHF, Em4100/T5577/Mf S50/Ucode etc.

Magnetic Stripe

Optional, Hico or Loco

Holographic Overlay

Optional, for Added Security

Personalisation

Customizable with Chip Encryption, Barcode etc.

Barcode/Qr Code

Optional, Can Be Printed on The Card

Print Quality

High-Resolution Printing for Images and Text

Finish

Glossy or Matte

Edge Design

Smooth or Rounded Edges

Transport Package

Air, Ocean, Courier

Specification

CR80 Credit card size or customized

Trademark

ST or OEM

Origin

Shanghai, China

HS Code

3926909090

Production Capacity

60 Millions/Year

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceYears of Export ExperienceCustomization from Designs

Shanghai Star Trend Enterprise Co., Ltd.

Shanghai, China

Business Type: Manufacturer/FactoryExport Year: 2001-01-08Nearest Port: ShanghaiAverage Response Time: ≤18hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, CFR, CIF, DDP, CPT, EXW

AI-Powered supplier vetting

SummaryShanghai Star Trend Enterprise Co., Ltd. is identified across the slices as a China-based limited company operating in Shanghai, with conflicting classifications as both a trading company and a manufacturer/factory. It has in-stock capability, self-operated import/export rights, 90% export sales, and access to Shanghai port, but no overseas warehouse, showroom, agents, or branches. The supplier supports customization from samples and designs, while its R&D profile is limited: one R&D engineer, no new products in the past year, no ODM, SDK, or 3D software design services. Complaint handling and corrective/preventive action procedures have records, but quality assurance, raw-material traceability, fire-drill status, and environmental-assessment status are not established in the provided information. Financial credibility and customer-case evidence cannot be adequately assessed because the relevant slices provide only years rather than substantive performance data, and no financial figures are reported.

After-Sales capabilityThe supplier has a documented and followed procedure for handling customer complaints, and its company description references after-sales service. However, it has no overseas agents or branches, overseas warehouse, or showroom, which may limit local support infrastructure.

R&D capabilityInnovation evidence is limited: the supplier has one R&D engineer, launched no new products in the past year, does not provide ODM, SDK, or 3D software design services, and is not identified as a professional technical supplier. These stated limitations indicate weak innovation capability for technology-led development.

Production capacityThe supplier reports three card manufacturing facilities around Shanghai, in-stock service capability, self-operated import/export rights, 90% export sales, and proximity to Shanghai port. However, outsourcing procedures and manufacturing contracts are marked unknown, so the full production-control system cannot be confirmed.

Customization capabilityThe supplier explicitly provides customization from samples and from customer designs. This supports product customization, although the records do not establish broader engineering, 3D software, ODM, or SDK capability.