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We provide free artwork design, technology proposals, flexible packing, reliable shipping, and stock management to save costs and accelerate delivery.

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RFID Proximity Smart Encoded Key Card

Name: RFID Proximity Smart Encoded Key Card
Brand: Shanghai Star Trend Enterprise Co., Ltd.
SKU: 863680615

Shanghai, ChinaShanghai Star Trend Enterprise Co., Ltd.

US$0.07-0.15

500 Pieces

Product profile

Customization

Available

Function

Identification, Payment, Encrypt/Decrypt, Information

Type

Non-Contact

Model NO.

RFID014

Structure

N/a

Material

PVC

Classification

Smart Card

Application Field

Jewellery Store, Club

Power Supply Mode

N/a

Data Transmission Mode

N/a

Lamination

Glossy, Matt, Double-Sided Film

Transport Package

Air, Ocean, Express

Specification

ISO CR80 3.375" x 2.125", 860micron

Trademark

OEM

Origin

Shanghai, China

HS Code

85235210

Production Capacity

3 Millions/Month

Key features

Customizable Lamination: Options include Glossy, Matt, and Double-Sided Film finishes.

High-Quality PVC Material: Made from new PVC plastic with lamination and rounded corners for durability.

Free Sample Service: Free samples available with 7-day express service after digital proof confirmation.

Professional Printing Services: Supports Logo, UID, and Barcode printing with guaranteed turnaround times.

Trusted Manufacturer: Over 20 years of experience exporting to 70+ countries since 2001.

Comprehensive Support: Includes free artwork design, flexible packing, and reliable shipping solutions.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceYears of Export ExperienceCustomization from Designs

Shanghai Star Trend Enterprise Co., Ltd.

Shanghai, China

Business Type: Manufacturer/FactoryExport Year: 2001-01-08Nearest Port: ShanghaiAverage Response Time: ≤18hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, CFR, CIF, DDP, CPT, EXW

AI-Powered supplier vetting

SummaryShanghai Star Trend Enterprise Co., Ltd. is identified across the slices as a China-based limited company operating in Shanghai, with conflicting classifications as both a trading company and a manufacturer/factory. It has in-stock capability, self-operated import/export rights, 90% export sales, and access to Shanghai port, but no overseas warehouse, showroom, agents, or branches. The supplier supports customization from samples and designs, while its R&D profile is limited: one R&D engineer, no new products in the past year, no ODM, SDK, or 3D software design services. Complaint handling and corrective/preventive action procedures have records, but quality assurance, raw-material traceability, fire-drill status, and environmental-assessment status are not established in the provided information. Financial credibility and customer-case evidence cannot be adequately assessed because the relevant slices provide only years rather than substantive performance data, and no financial figures are reported.

After-Sales capabilityThe supplier has a documented and followed procedure for handling customer complaints, and its company description references after-sales service. However, it has no overseas agents or branches, overseas warehouse, or showroom, which may limit local support infrastructure.

R&D capabilityInnovation evidence is limited: the supplier has one R&D engineer, launched no new products in the past year, does not provide ODM, SDK, or 3D software design services, and is not identified as a professional technical supplier. These stated limitations indicate weak innovation capability for technology-led development.

Production capacityThe supplier reports three card manufacturing facilities around Shanghai, in-stock service capability, self-operated import/export rights, 90% export sales, and proximity to Shanghai port. However, outsourcing procedures and manufacturing contracts are marked unknown, so the full production-control system cannot be confirmed.

Customization capabilityThe supplier explicitly provides customization from samples and from customer designs. This supports product customization, although the records do not establish broader engineering, 3D software, ODM, or SDK capability.