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4-Pin Hermetic to-Can Package for Mems Optical Sensor and Photodetector
US$5.00-100.00
1,000 Pieces
Sample price:US$5.00/piece.Request sample
Product profile
Customization
AvailableMetal Coating
GoldMode of Production
COBModel NO.
KMO-001-1Layers
Ceramic SubstrateBase Material
CeramicCertification
ISOCustomized
CustomizedCondition
NewPackage Type
to-Can PackageCap Type
Window Cap / Customized CapPackage Material
According to Customer SpecificationsScope of Application
Optical Communication / PhotodetectorsWavelength / Operating Wavelength
850nm / 1310nm / 1550nmHermeticity
Hermetic SealedTransport Package
ESD Protective Packaging/Carton BoxSpecification
CustomizedTrademark
OEMOrigin
ChinaProduction Capacity
60000000pieces/YearKey features
Precision TO-CAN Packaging: Professional packaging solutions for optoelectronic semiconductor devices and laser components.
Customized Package Design: Support for customer-specific dimensions, header structures, window caps, and package configurations.
Optical Device Applications: Suitable for laser diodes, photodetectors, optical sensing, and optical communication components.
Reliable Assembly Processes: Focus on assembly precision, structural consistency, and manufacturing quality.
OEM Manufacturing Services: Customized production based on customer drawings, technical specifications, and project requirements.
Quality Assurance: Process inspection and quality control throughout manufacturing to support consistent product performance.
Flexible Customization: Offers full customization from samples, designs, and minor adjustments.
Global Logistics Support: Flexible trade terms (EXW, FOB, CIF) with DHL, FedEx, and UPS options.
Company profile
CertifiedBusiness Type: Manufacturer/Factory CertifiedR&D Capacity: OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2023-08-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.44h
About Our Factory & Business Background
AddressShenzhen, Guangdong, China
Plant Area6500 square meters
Number of Employees180
Registered Capital1,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)FOB, CIF, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Minimum Order Quantity1000 Pcs
Supply Chain Partners6
Our Production Capability & Technical Expertise
Main ProductsOptical Transceiver Module PCBA, FPGA&RF PCBA, Automotive Electronic PCBA, Smart Wear PCBA, Smart Home Devices and IoT PCBA
Production Lines21
Production MachinesSMT Line, Laser Marking Machine, V-Cutting Machine, Wave-soldering Machine, Off-line Dispenser, AI AOI, AOI, X-RAY Counter, X-RAY, Auto Soldering Machine
QA/QC inspectors20 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers1 people
Traceability of Raw MaterialsYes
Our Industry Experience & Global Business Record
Year of Establishment2023-09-20
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Product Q&A
Q:What types of optoelectronic packaging services do you provide?
A:
We provide customized TO-CAN packaging, optoelectronic device packaging, and butterfly laser packaging services for optical communication and related applications. Our capabilities can be tailored to different device structures and technical requirements. Please share your product specifications for evaluation.
Q:What information is required for a customized packaging quotation?
A:
To provide an accurate quotation, please share your device specifications, package drawings, technical requirements, estimated order quantity, and target delivery date. If available, please also provide the chip specifications and assembly or testing requirements.
Q:Can you provide quality inspection and functional testing?
A:
Quality control and testing requirements can be discussed according to the product design and project specifications. Please let us know your required inspection items, testing standards, and acceptance criteria so we can evaluate the project and confirm the available services.
Q:Do you support customized TO-CAN and butterfly laser packages?
A:
Yes. We can evaluate customized TO-CAN, optoelectronic, and butterfly laser packaging projects according to the product design and technical requirements. Please share your drawings, specifications, and expected quantity for an engineering review.
Q:Do you accept customer-supplied chips and materials for packaging?
A:
Customer-supplied materials may be considered depending on the project requirements and process compatibility. Please provide the chip specifications, material list, packaging drawings, and required process details so we can assess feasibility.
Send Inquiry
*To:
Shenzhen Sunwin Electronic Technology Co., Ltd
Shenzhen Sunwin Electronic Technology Co., Ltd*Content:
Supplier replies will be sent to your registered email
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