Precision Optical Chip Packaging with Fiber Coupling on Ceramic Base

We provide customized TO-CAN packaging, optoelectronic device packaging, and butterfly laser packaging services for optical communication and related applications. Our capabilities can be tailored to different device structures and technical requirements. Please share your product specifications for evaluation.

To provide an accurate quotation, please share your device specifications, package drawings, technical requirements, estimated order quantity, and target delivery date. If available, please also provide the chip specifications and assembly or testing requirements.

Quality control and testing requirements can be discussed according to the product design and project specifications. Please let us know your required inspection items, testing standards, and acceptance criteria so we can evaluate the project and confirm the available services.

Yes. We can evaluate customized TO-CAN, optoelectronic, and butterfly laser packaging projects according to the product design and technical requirements. Please share your drawings, specifications, and expected quantity for an engineering review.

Customer-supplied materials may be considered depending on the project requirements and process compatibility. Please provide the chip specifications, material list, packaging drawings, and required process details so we can assess feasibility.