Extensive Layer Range: Supports 1 to 36 layers for complex circuit designs.
High Precision Capabilities: Min line width and space 0.10mm with 0.25mm min drilled hole.
Comprehensive Surface Finishes: Options include HASL, Chemical Tin, Immersion Gold, OSP, and Gold Plating.
Full Traceability System: MES system ensures full barcode tracking for components and batches.
Advanced Assembly Services: Supports SMT, DIP, COB, Flip Chip, and SIP assembly technologies.
Multi-Stage Quality Inspection: Includes AOI, SPI, X-ray, ICT, and FCT testing protocols.
Flexible Customization: Offers full customization from samples, designs, and minor adjustments.
High Production Capacity: 21 SMT lines capable of 20 million chips daily and 600 million monthly.