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Vacuum Plasma Cleaner for Pdms Bonding Microfluidic Chip Surface Activation
US$3,500.00
1-2 Pieces
US$3,200.00
3-9 Pieces
US$3,000.00
10+ Pieces
Product profile
Customization
AvailableType
GeneratorFeature
High PressureModel NO.
GD-5Certification
RoHS, CECondition
NewCustomized
CustomizedPrinciple
Chemical CleaningFuel
ElectricFunction
Improve Adhesion and HydrophilicVideo Outgoing-Inspection
ProvidedProcessing Type
Plasma Dry CleaningShowroom Location
Spain, South KoreaTransport Package
Wooden BoxSpecification
560*550*400 mmTrademark
FARIOrigin
Guangdong, ChinaKey features
PDMS Surface Activation: Modify PDMS and glass surface via oxygen plasma to achieve strong irreversible bonding for microfluidic chips.
Leak-proof Microchannel Bonding: Avoid poor sealing & fluid leakage; plasma treatment activates substrate surfaces to form tight, leak-free microfluidic channels.
Fast Plasma Processing: Complete PDMS activation within 60-180s, cutting chip preparation time by over 70% compared with traditional bonding methods.
Lab Microfluidic Chip Fabrication: Benchtop compact design delivers stable plasma performance for university labs and R&D microfluidic chip development.
Controllable Plasma Uniformity: Offers more consistent surface activation than low-end plasma cleaners, delivering reliable bonding results for precision microfluidic research.
Company profile
CertifiedBusiness Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.89h
AI-Powered supplier vetting
SummaryThe supplier is identified as a professional technical supplier offering 3D software design, broad customization, ODM, and OEM services. It reports new product development, four R&D engineers, and multiple documented quality and service procedures. ISO9001:2015 and CE certifications are stated, along with product traceability and quality assurance. Overseas service is available in Vietnam, Germany, and the United States, with training, repair, maintenance, and debugging support, although the supplier has no overseas warehouse, showroom, agent, or branch. Financial records are referenced for 2021–2023, but the slices do not provide financial results sufficient to assess financial credibility. Production scale and capacity are not clearly stated. The supplier reports no Fortune 500 cooperation, while OEM cooperation with well-known brands is stated without naming specific customers.
Supplier typeThe supplier explicitly identifies itself as a professional technical supplier, provides 3D software design, and offers ODM and OEM services. It also holds self-operated import and export rights and has exported for 13 years, supporting its classification as an experienced technical and export-oriented supplier.
CertificationsThe supplier states that it holds an ISO9001:2015 management-system certificate and CE product compliance certification. It also reports quality assurance, uniformly followed finished-product inspection instructions, and raw-material traceability, indicating documented quality-management practices.
After-Sales capabilityThe supplier provides training, repair, maintenance, and debugging services in Vietnam, Germany, and the United States. It reports written procedures and records for service assessment, corrective and preventive actions, and complaint handling, with an average lead time within 15 workdays in both off-season and peak season.
R&D capabilityThe supplier provides 3D software design, reports new products during the past year, offers ODM services, and has four R&D engineers. However, it explicitly has no available SDK, so the evidence supports product and design innovation but not SDK-based development capability.
Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. Its 3D design, ODM, and OEM services further support a broad ability to handle customized products and designs.
Product Q&A
Q:How long does PDMS plasma activation take for microfluidic chip bonding?
A:
Normally 60to180 seconds. The processing time can be adjusted according to your PDMS thickness, surface roughness and target contact angle.
Q:Can this vacuum plasma cleaner realize irreversible bonding between PDMS and glass?
A:
Yes. Using oxygen plasma treatment, it activates PDMS and glass surfaces to form hydroxyl groups, achieving permanent irreversible bonding without adhesive, ideal for microfluidic chip fabrication.
Q:Can I adjust plasma power and vacuum pressure?
A:
Yes. Plasma power, vacuum level, gas flow and processing duration are fully adjustable on the touch screen for repeatable microfluidic experiments.
Q:Will plasma treatment damage the thin PDMS microfluidic chip?
A:
Proper parameters will not damage PDMS. We can provide recommended process recipe for PDMS bonding for your reference.
Q:What is your warranty period?
A:
1-year warranty for the whole machine
Send Inquiry
*To:
Shenzhen Fangrui Technology Co., Ltd.
Shenzhen Fangrui Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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