UC2845bd1r2g Integrated Circuits Original Stock IC Chip Power Management Electronic Component UC2845bd1r2g

Name: UC2845bd1r2g Integrated Circuits Original Stock IC Chip Power Management Electronic Component UC2845bd1r2g
Brand: Shenzhen Gewei Technology Co., Ltd.
SKU: 2101559695

Guangdong, ChinaShenzhen Gewei Technology Co., Ltd.

US$0.001

1 Piece

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Batch Number

2010+

Manufacturing Technology

Integrated Circuits Device

Model NO.

UC2845BD1R2G

Material

Element Semiconductor

Model

Package

SMD

Signal Processing

Digital

Type

N-Type Semiconductor

Model No.

UC2845bd1r2g

Technics

Semiconductor IC

Types

Non-Volatile Memory

Memory Format

Eeprom

Memory Size

1kbit

Memory Organization

128 X 8, 64 X 16

Memory Interface

3-Wire Serial

Clock Frequency

2 MHz

Write Cycle Time - Word, Page

10ms

Voltage - Supply

2.7V ~ 5.5V

Operating Temperature

-40 Degree ~ 85degree (Ta)

Sample

Free Sample Provided

Service

12 Year Bom and One -Stop Solution Service

Transport Package

Carton Box

Specification

2400 pcs/ Roll

Trademark

Original Memory Chip

Origin

Original

HS Code

8542399000

Production Capacity

10000PCS/Week

Company profile

High Repeat Buyers ChoiceYears of Export ExperienceExperienced Team

Shenzhen Gewei Technology Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2012-10-01Nearest Port: Shenzhen GuangzhouAverage Response Time: ≤7.63hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): FOB, EXW

AI-Powered supplier vetting

SummaryThe supplier is identified as Shenzhen Gewei Technology Co., Ltd., a China-based limited company in Guangdong, with records alternatively describing it as a manufacturer/factory and a trading company. Its offerings include fiber-optic cables, connectors, SFP modules, cables, and PLC splitters. The supplier reports multiple management-system certifications, R&D personnel experience, quality-control staffing, batch production, inventory capability, customization, ODM, and OEM services. It also states that it provides rapid technical support and after-sales service. However, it lacks documented corrective/preventive-action and customer-complaint procedures, has no approved-supplier list, no overseas warehouse or showroom, no 3D software design service, and no SDK. Financial information is present only as year labels, without sufficient performance detail. No specific customer names or verifiable customer cases are provided.

CertificationsThe supplier lists BSCI, ISO 9000, OHSAS/OHSMS 18001, TS 16949, ISO 14001, ISO 9001, ISO 20000, and ISO 14064 certifications. The record does not provide certificate numbers, issuing bodies, validity dates, or scope, so the listed holdings are positive but cannot be independently validated from the provided data.

After-Sales capabilityThe company states that it provides rapid technical support and after-sales service. However, it has no written procedures or records for effectively handling customer complaints or for corrective and preventive actions, and its overseas service infrastructure is limited because it has no overseas warehouse or showroom.

R&D capabilityThe supplier reports new products within the past year, provides ODM services, and has 11–20 years of total R&D-engineer experience. Conversely, it does not provide 3D software design services and has no available SDK; the evidence supports product-development capability but not a broad software innovation capability.

Production capacityThe supplier reports batch production capacity, rapid technical support, annual production output above the stated threshold, 6–10 quality-control staff, and in-stock service capability. A valid manufacturing-capacity contract is not confirmed, but the explicit production and inventory statements support a positive assessment.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, minor customization, full customization, and flexible customization, as well as ODM services. These records indicate broad product customization capability, although the separate absence of 3D software design services limits the scope of design support.