Powered by Made-in-China.com
Exportable High Precision Silicon Wafers Thinning and Lapping Machine for Gallium Nitride
US$30,000.00-50,000.00
1 Piece
Sample price:US$10.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
12monthsWarranty
12monthsModel NO.
PDG 1300 SATType
Surface Grinding MachineProcessing Object
Flat WorkpiecesAbrasives
Grinding WheelControlling Mode
PLCAutomatic Grade
SemiautomaticCylindrical Grinder Type
Surface Grinding MachinePrecision
High PrecisionCertification
ISO 9001Condition
NewPower Source
ElectricityWorking Style
High-Speed UniversalVariable Speed
with Variable SpeedObject
WaferApplication
Electronic TechniqueDisc(Wheel) Type
Thinning MachineTransport Package
PondaTrademark
PONDAOrigin
ChinaProduction Capacity
500 Unit/YearKey features
High-Precision Thinning Machine
Shenzhen Ponda semiconductor equipment for Sapphire
Used for thinning semiconductor materials such as quartz glass, diamond, silicon wafers, ceramics and lithium niobate
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤10.96h
AI-Powered supplier vetting
SummaryThe supplier is an integrated company offering R&D, design, manufacturing, sales, and after-sales services, with a focus on grinding equipment and related services. They have a strong emphasis on customization and innovation, supported by a capable R&D team. While they do not have overseas warehouses or showrooms, they have a moderate export presence and a structured approach to service capability and customer complaints. Financial data indicates stability, though specific certifications are not noted in the available information.
Supplier typeThe supplier is involved in R&D, design, manufacturing, and sales, focusing on grinding equipment and related services, indicating a comprehensive service scope.
After-Sales capabilityThe company offers robust after-sales support with clear written procedures for service capability, though lacks written records for handling customer complaints.
R&D capabilityThe supplier demonstrates strong innovation capability with ongoing R&D efforts and new product development over the past year.
Production capacityThe supplier operates 5 production lines with an annual output of US$5-10 million, supported by a sizable quality control staff.
Customization capabilityThe supplier offers extensive customization options, including full and minor modifications, from samples and designs.
Product Q&A
Q:Does Ponda charge for making samples?
A:
No, it's free to make samples.
Q:Is Ponda trader or manufacturer?
A:
We are manufacturer, certified National High-Tech Enterprise.
Q:How long does it take machine to deliver?
A:
Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q:Does Ponda provide oversea setup and after-sale service?
A:
Yes, we provide oversea service and online tutorial.
Q:How many type of machine does Ponda manufacture?
A:
We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
Send Inquiry
*To:
Shenzhen Ponda Grinding Technology Co.,Ltd.
Shenzhen Ponda Grinding Technology Co.,Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
for Grinding Diamond Semiconductor Materials Automatic Wafer Grinding and Thinning Machine
US$30,000.00-50,000.00
1 Piece(MOQ)
Silicon Wafer, Mould, Light Guide Plate, Optical Fiber Connector, Valve Plate Precision Grinding Machine
US$8,000.00-20,000.00
1 Piece(MOQ)
High Precision Portable Lapping and Grinding Machine for Globe Valve Sealing with Good Price
US$12,000.00-14,000.00
1 Piece(MOQ)
High Precision Valves Surface Lapping and Thinning Machine for Sapphire Glass Ceramic
US$30,000.00-50,000.00
1 Piece(MOQ)
High Precision Monocrystalline Silicon Lapping Thinning Machine
US$20,000.00-60,000.00
1 Piece(MOQ)
Stationary Grinding and Lapping Machine for The Machining of Sealing Surfaces with High Speed From China Manufacturer
US$8,900.00-12,500.00
1 Piece(MOQ)
Silicon Wafer Double Side Grinding Machine for IC Manufacturing
US$6,500.00-7,000.00
1 Piece(MOQ)
Silicon Wafer Double Side Grinding Machine for IC Wafer
US$6,500.00-7,000.00
1 Piece(MOQ)
High Precision Sharpening Machine for PCD and Cutting Tools
US$10,000.00-11,000.00
1 Set(MOQ)
Silicon Wafer Thinning Machine for Semiconductor Industry
US$6,500.00-7,000.00
1 Piece(MOQ)
Precision Double Sided Surface Grinding Polishing and Lapping Machine for Ceramics
US$41,000.00-65,000.00
1 Piece(MOQ)
Silicon Wafer Thinning Machine for Microelectronics
US$6,500.00-7,000.00
1 Piece(MOQ)
Hot Sale High Precision CNC External Cylindrical Grinding Grinder Machine for Outer Lapping with Good Price
US$23,700.00-34,300.00
1 Piece(MOQ)
High Precision Rotary Table Surface Grinding Flat Lapping Machine for Metal Ceramic
US$4,800.00
1 Piece(MOQ)
High Precision CNC Grinding Machine for Sharpening Tap and Thread
US$89,300.00
1 Piece(MOQ)
Popular Precision Single-Lapping Machine for Diamond Wafers
US$133,800.00
1 Set(MOQ)
High Precision Insert Chamfering Machine for CBN and Carbide
US$3,000.00
1 Piece(MOQ)