for Grinding Semiconductor Materials Such as Diamond Fully-Automatic Wafer Thinning Machine

Name: for Grinding Semiconductor Materials Such as Diamond Fully-Automatic Wafer Thinning Machine
Brand: Shenzhen Ponda Grinding Technology Co.,Ltd.
SKU: 1975730921

Guangdong, ChinaShenzhen Ponda Grinding Technology Co.,Ltd.

US$30,000.00-50,000.00

1 Piece

Sample price:US$5.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

12months

Warranty

12months

Model NO.

300A

Type

Surface Grinding Machine

Processing Object

Flat Workpieces

Abrasives

Grinding Wheel

Controlling Mode

PLC

Automatic Grade

Semiautomatic

Cylindrical Grinder Type

Surface Grinding Machine

Precision

High Precision

Certification

ISO 9001

Condition

New

Power Source

Electricity

Working Style

High-Speed Universal

Variable Speed

with Variable Speed

Object

Wafer

Application

Electronic Technique

Disc(Wheel) Type

Thinning Machine

Transport Package

Ponda

Trademark

PONDA

Origin

China

Production Capacity

500 Unit/Year

Key features

Fully Automatic Operation: Independently designed and manufactured fully automatic wafer grinding machine with stable performance.

Wide Material Compatibility: Grinds Si, Ge, GaAs, SiC, diamond, quartz glass, and various semiconductor materials.

High Precision Measurement: Equipped with online thickness measurement with 1um precision (contact or non-contact NCG).

Marble Base Stability: Uses marble base and air-floating turntable for greatly improved overall equipment stability.

Self-Developed Spindles: Features breakthrough high-power hydrostatic air-bearing spindles and bearing platforms.

Intuitive User Interface: LCD touch-screen graphical user interface for intuitive operation and maintenance.

Flexible Wafer Sizes: Capable of grinding various wafers ranging from 3 to 12 inches.

Adjustable Surface Roughness: Surface roughness is adjustable according to specific customer requirements.

Company profile

Cooperated with Fortune 500Years of Export ExperienceExperienced TeamR&D Capabilities

Shenzhen Ponda Grinding Technology Co.,Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤15h

AI-Powered supplier vetting

SummaryThe supplier is an integrated company offering R&D, design, manufacturing, sales, and after-sales services, with a focus on grinding equipment and related services. They have a strong emphasis on customization and innovation, supported by a capable R&D team. While they do not have overseas warehouses or showrooms, they have a moderate export presence and a structured approach to service capability and customer complaints. Financial data indicates stability, though specific certifications are not noted in the available information.

Supplier typeThe supplier is involved in R&D, design, manufacturing, and sales, focusing on grinding equipment and related services, indicating a comprehensive service scope.

After-Sales capabilityThe company offers robust after-sales support with clear written procedures for service capability, though lacks written records for handling customer complaints.

R&D capabilityThe supplier demonstrates strong innovation capability with ongoing R&D efforts and new product development over the past year.

Production capacityThe supplier operates 5 production lines with an annual output of US$5-10 million, supported by a sizable quality control staff.

Customization capabilityThe supplier offers extensive customization options, including full and minor modifications, from samples and designs.