High-Precision Chamfering: Supports double-sided chamfering for silicon, sapphire, SiC, and glass wafers up to 8 inches.
Dual Wafer Processing: Capable of chamfering two wafers simultaneously with rough and fine grinding in one step.
Automated CCD Positioning: Uses CCD vision for automatic calibration, measurement, and dimension control of wafers.
Automatic Cleaning System: Features automatic cleaning and spin-drying functions for dry-in and dry-out processes.
Full Automation: All processes are fully automatic, with each step executed by a manipulator.
Variable Speed Control: Equipped with variable speed capabilities for versatile processing requirements.
Comprehensive Warranty: Includes a 12-month warranty and 12-month after-sales service coverage.
ISO Certified Quality: Manufactured with ISO certification ensuring high standards and reliability.