High-Precision Chamfering: Processes silicon, sapphire, SiC, and ceramics with CCD vision positioning for accuracy.
Dual-Wafer Simultaneous Processing: Chamfers two wafers at once with one-key rough and fine grinding capabilities.
Automatic Cleaning & Drying: Features automatic cleaning and spin-drying for dry-in and dry-out efficiency.
Full Automation with Manipulators: All steps executed by manipulators ensuring fully automatic operation.
Flexible Wafer Size Support: Supports 6-inch and 8-inch wafers with 5 dedicated cartridge boxes.
OEM and ODM Services: Offers full customization, minor customization, and flexible customization options.
Overseas Setup & Support: Provides overseas installation services and online tutorials for after-sales.
ISO Certified Quality: Manufactured by a certified National High-Tech Enterprise with ISO standards.