Silicon Wafer Thinning Machine for Semiconductor Factory

Name: Silicon Wafer Thinning Machine for Semiconductor Factory
Brand: Shenzhen Ponda Grinding Technology Co.,Ltd.
SKU: 2313572005

Guangdong, ChinaShenzhen Ponda Grinding Technology Co.,Ltd.

US$155,840.00-183,774.00

1 Piece

Sample price:US$5.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

12months

Warranty

12months

Model NO.

PDG 3300 AT

Type

Surface Grinding Machine

Processing Object

Flat Workpieces

Abrasives

Grinding Wheel

Controlling Mode

PLC

Automatic Grade

Semiautomatic

Cylindrical Grinder Type

Surface Grinding Machine

Precision

High Precision

Certification

ISO 9001

Condition

New

Power Source

Electricity

Working Style

High-Speed Universal

Variable Speed

with Variable Speed

Object

Wafer

Application

Electronic Technique

Disc(Wheel) Type

Thinning Machine

Transport Package

Ponda

Trademark

PONDA

Origin

China

Production Capacity

500 Unit/Year

Company profile

Cooperated with Fortune 500Years of Export ExperienceExperienced TeamR&D Capabilities

Shenzhen Ponda Grinding Technology Co.,Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 18 years CertifiedNearest Port: Shenzhen Yantian PortAverage Response Time: ≤7.14h

AI-Powered supplier vetting

SummaryThe supplier integrates R&D, design, manufacturing, sales, and after-sales service, producing grinding equipment, accessories, and consumables for optical, electronics, mold, metal, and hardware applications. It reports 3D software design capability, multiple customization modes, and new products developed within the past year. Manufacturing includes five production lines, while quality control staffing is reported at 21–30 personnel. The company has 18 years of export experience, self-operated import/export rights, and markets covering Asia, Europe, Australia, North America, and domestic customers. Service procedures and corrective/preventive-action records exist, but complaint handling lacks written records. No overseas warehouse, showroom, agent/branch, or offline trade-show participation is reported. Financial records are identified for 2021–2023, but their results are not provided. Customer-specific cases and certifications are not evidenced.

Supplier typeThe supplier is a manufacturer and integrated industrial service provider: its stated scope includes production, sales, technology development, R&D, software services, import/export, and after-sales-related functions. Its products focus on grinding equipment, accessories, consumables, and applications across optical, electronics, molds, metal parts, and hardware.

R&D capabilityThe supplier reports integrated R&D and design functions, 3D software design services, ten years of total R&D engineer experience, and new product development during the past year. These details support an active product-development capability.

Production capacityThe supplier manufactures grinding equipment, accessories, and consumables and operates five production lines. It reports 21–30 quality-control staff, but does not continuously reconcile quantities for each batch or production volume, indicating a documented manufacturing-control weakness.

Customization capabilityThe supplier explicitly offers customization from samples and designs, full, minor, and flexible customization, together with 3D software design services. This demonstrates broad stated customization coverage.