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0.8mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
US$60.00
10 g
Product profile
Customization
AvailableType
BareConductor Type
AlloyApplication
Microelectronics, LED Packaging, IC PackagingConductor Material
AlloyMaterial Shape
Round WireRange of Application
Microelectronics, LED Packaging, IC PackagingCertification
ISO9001, CE, CCC, RoHSLength
500m or 1000mWire Diameter
0.7-3.0milMaterial
Au, AG, Pd, CuTransport Package
Bubble Chamber, Paper BoxOrigin
ChinaProduction Capacity
100000Company profile
Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤6.70hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB
About Our Factory & Business Background
AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:Shenzhen Silver Technologies Ltd
Shenzhen Silver Technologies Ltd*Content:
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