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0.9mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED
US$200.00
10 g
Product profile
Customization
AvailableType
WireConductor Type
SilverModel NO.
0.9milConductor Material
AlloySheath Material
NonInsulation Material
NonMaterial Shape
Round WireRange of Application
Bonding WireCertification
ISO9001, CE, CCC, RoHSBrand
Jnajna DyWidth Size Factory
±5%Thickness Dimension Factory
±10%Gold Content
99.99%Shaft Dimensions
0.5 Inch 2inchTransport Package
Bubble Chamber, Paper BoxSpecification
0.015-0.5MMTrademark
JNAJAN DYOrigin
ChinaCompany profile
Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤8.13hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB
About Our Factory & Business Background
AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Send Inquiry
*To:Shenzhen Silver Technologies Ltd
Shenzhen Silver Technologies Ltd*Content:
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