0.9mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED

Name: 0.9mil Bonding Gold Wire Widely Used in Electronic Components for IC/LED
Brand: Shenzhen Silver Technologies Ltd
SKU: 2037799675

Guangdong, ChinaShenzhen Silver Technologies Ltd

US$200.00

10 g

Product profile

Customization

Available

Type

Wire

Conductor Type

Silver

Model NO.

0.9mil

Conductor Material

Alloy

Sheath Material

Non

Insulation Material

Non

Material Shape

Round Wire

Range of Application

Bonding Wire

Certification

ISO9001, CE, CCC, RoHS

Brand

Jnajna Dy

Width Size Factory

±5%

Thickness Dimension Factory

±10%

Gold Content

99.99%

Shaft Dimensions

0.5 Inch 2inch

Transport Package

Bubble Chamber, Paper Box

Specification

0.015-0.5MM

Trademark

JNAJAN DY

Origin

China

Company profile

Shenzhen Silver Technologies Ltd

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤6.70hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB

About Our Factory & Business Background

AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire