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1.2mil Gold/Silver Alloy Bonding Wire for Microelectronics, LED Packaging, IC Packaging
US$35.00
20 g

Product profile

Customization

Available

Type

Bonding Wire

Conductor Type

Silver

Model NO.

1.2mil

Application

Microelectronics, LED Packaging, IC Packaging

Conductor Material

Alloy

Sheath Material

Non

Insulation Material

Non

Material Shape

Round Wire

Range of Application

Microelectronics, LED Packaging, IC Packaging

Certification

ISO9001, CE, CCC, RoHS

Brand

Jnajna Dy

Length

500m or 1000m

Wire Diameter

0.7-3.0mil

Material

Au, AG, Pd, Cu

Transport Package

Bubble Chamber, Paper Box

Specification

0.02-0.5MM

Trademark

JNAJAN DY

Origin

China

Production Capacity

100000PCS

Company profile

Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤6.70hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB

About Our Factory & Business Background

AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire

Our Industry Experience & Global Business Record

Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

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*To:Shenzhen Silver Technologies LtdShenzhen Silver Technologies Ltd
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