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Bonding Alloy Wire, Gold-Plated Wire, Semiconductors, Microelectronic Packaging
US$0.13
11,000 Meters
Product profile
Customization
AvailableProduct Type
WireMaterial
GoldModel NO.
Bonding alloy wireCarbon Content
Low CarbonPCD
CustomizeET
CustomizeHole
CustomizeTransport Package
CartonSpecification
cartonTrademark
JIAJIADUOrigin
ShanghaiProduction Capacity
1000000Key features
High Conductivity Materials: Available in gold, aluminum, silver, and tungsten for optimal performance.
Customizable PCD and ET: PCD and ET parameters can be customized to meet specific requirements.
Customizable Hole Size: Hole dimensions are customizable for precise application needs.
Wide Application Scope: Used in semiconductors, microelectronic packaging, smartphones, and automotive electronics.
Excellent Reliability: Ensures stable connection and packaging inside chips with high reliability.
Fast Lead Time: Peak and off-peak season lead times are both within 15 workdays.
Low Carbon Content: Product features low carbon content for enhanced material quality.
Global Market Reach: Serves markets in North America, Europe, Asia, Africa, and Oceania.
Company profile
Business Type: Manufacturer/FactoryExport Year: 2023-01-03Nearest Port: shenzhenAverage Response Time: ≤6.70hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB
About Our Factory & Business Background
AddressNo. 606, Zhaofengxiang Building, No. 8 Liye Road, Songgang Street, Baoan District, Shenzhen, Guangdong, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsAlloy, Occ Wire, Bonding Wire, Copper Wire, PT/IR Alloy Wire, Platinum-Rhodium Wire, Platinum Coated with Nickel Wire, Platinum Tungsten Alloy Wire, Platinum Nickel Alloy Wire, PT Wire
Our Industry Experience & Global Business Record
Main MarketsNorth America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Product Q&A
Q:What materials are used for bonding alloy wire?
A:
Bonding alloy wire is made from gold, aluminum, copper, silver, tungsten, and other materials.
Q:Can the PCD and ET be customized?
A:
Yes, both PCD and ET are customizable options for this product.
Q:What is the lead time for production?
A:
The lead time is within 15 workdays for both peak and off-peak seasons.
Q:Where is this product mainly used?
A:
It is widely used in semiconductors, microelectronic packaging, smartphones, and automotive electronics.
Q:What are the payment terms?
A:
The accepted payment term is T/T.
Send Inquiry
*To:Shenzhen Silver Technologies Ltd
Shenzhen Silver Technologies Ltd*Content:
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