1023 High-Temperature One-Component Epoxy Potting Compound for 280℃ Resistant, Black Liquid Electronic Component Encapsulation, 130℃@1h Curing

Name: 1023 High-Temperature One-Component Epoxy Potting Compound for 280℃ Resistant, Black Liquid Electronic Component Encapsulation, 130℃@1h Curing
Brand: Shenzhen Taile Glue Co., Ltd.
SKU: 2333503765

Guangdong, ChinaShenzhen Taile Glue Co., Ltd.

US$3.60

10-99 kg

US$3.20

100-999 kg

US$3.00

1,000-9,999 kg

US$2.50

10,000+ kg

Sample price:US$3.60/kg.Request sample

Product profile

Customization

Available

Application

Automobile, Electronics / Electrical ,High-Temperature Potting

Bonding Function

Potting / Encapsulation

Model NO.

1023

Color

Black

Composition

Epoxy resin

Morphology

Liquid

Viscosity

4200 cps

Tg

140℃

Storage Condition

2~8℃@12 months

Temperature Resistance

-50℃~280℃

Curing Condition

130℃@1h

Specification

1kg/can

Trademark

Taile

Origin

China

HS Code

32141090

Production Capacity

5000kg/Month

Key features

One-component epoxy potting compound

Temperature resistance up to 280

High Tg: 140

Black liquid, easy for potting

Curing condition: 130@1h

Suitable for electronic component potting and encapsulation

Excellent high-temperature resistance

Excellent electrical insulation properties

Excellent physical properties

Protects component stability and reliability

Company profile

High Repeat Buyers ChoiceR&D CapabilitiesQA/QC InspectorsQuality Assurance

Shenzhen Taile Glue Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2024-07-15Nearest Port: shenzhen protAverage Response Time: ≤2.03h

AI-Powered supplier vetting

SummaryThe supplier is a Shenzhen-based limited company focused on electronic and industrial adhesives, with stated R&D, standardized production, testing, and technical-service capabilities. It offers ODM and OEM services and supports prototyping, small-batch trials, and large-scale delivery. However, the supplier reports no available SDK, no new products in the past year, no overseas showroom, agents, branches, or offline trade-show participation, and only five employees. Quality assurance and related procedures are stated, but several procedures lack written records or completed assessment records. Financial-related entries identify years but provide no assessable financial results. Customer cases are not explicitly documented, although OEM service for well-known brands is claimed.

Supplier typeThe supplier is a limited company with five employees and no stated parent-group affiliation. Its business focuses on R&D, production, sales, and technical services for electronic and industrial adhesives, supported by a production base and laboratory in Shenzhen.

R&D capabilityThe supplier describes independent R&D, formula innovation, process improvement, application development, a professional R&D laboratory, and rapid prototyping support. However, it reports no available SDK and no new products during the past year, creating a documented limitation despite its broader R&D claims.

Production capacityThe supplier states that it operates standardized production lines and a modern production base with testing instruments and quality management systems. It also claims support for small-batch trial production and large-scale delivery, which is direct evidence of production capability.

Customization capabilityThe supplier explicitly provides ODM services and supports rapid prototyping, small-batch trial production, process optimization, and mass-production applications. These capabilities directly support customized adhesive development and production.

Product Q&A

Q:What is 1023?

1023 is a one-component epoxy potting compound with high-temperature resistance up to 280. It is a black liquid designed for electronic component potting and encapsulation.

Q:What is the curing condition of 1023?

The curing condition is 130 for 1 hour.

Q:What are the main applications of 1023?

It is used for high-temperature potting and encapsulation of electronic components, such as transformers, sensors, motors, power modules, and LED.

Q:How should I store 1023?

Store at 2~8 for 12 months.

Q:What is the temperature resistance of 1023?

The temperature resistance range is -50 to 280, with a Tg of 140.