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High Dielectric Strength Heat Cure Epoxy Paste 6308 (H500-1) Power Electronic Magnetic Core Sealant
US$26.00
100-999 Pieces
US$25.00
1,000-9,999 Pieces
US$24.00
10,000-99,999 Pieces
US$23.00
100,000+ Pieces
Sample price:US$25.00/piece.Request sample
Product profile
Customization
AvailableApplication
Automobile, Construction, Packing, Mnzn, Nizn Ferrite Core & Metal HousingBonding Function
Structural AdhesiveModel NO.
6308(H500-1)Color
Black / White / Grey PasteComposition
Organic MaterialMorphology
Viscous PasteSpecific Gravity
1.20~1.26 G/Cm³Thixotropy
Excellent Anti-SaggingStorage
6 Months at -20℃ Frozen Storage; Store at 2~8℃ forHardness (Shore D)
60~70Thermal Conductivity
0.6 W/M·KDielectric Strength
≥20 Kv/mmWater Absorption
≤0.2%Shear Strength
≥17 MPaTransport Package
Carton with Bubble WrapSpecification
1kg per can, 5kg per can; custom special packagingTrademark
taileOrigin
ChinaHS Code
350610Production Capacity
100000000Key features
One component, no mixing, ready for dispensing directly
Excellent thixotropy, no sagging for thick layer filling
Outstanding electrical insulation, high dielectric strength
Low curing internal stress, resist cracking under thermal shock
Great adhesion to MnZn, NiZn ferrite core & metal housing
Continuous working temperature: -40c~150c
Good resistance to moisture, salt spray & humid aging
Eco-friendly formula, meet RoHS 2.0 & REACH
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2024-07-15Nearest Port: shenzhen protAverage Response Time: ≤1.42h
AI-Powered supplier vetting
SummaryThe supplier is a Shenzhen-based limited company focused on electronic and industrial adhesives, with stated R&D, standardized production, testing, and technical-service capabilities. It offers ODM and OEM services and supports prototyping, small-batch trials, and large-scale delivery. However, the supplier reports no available SDK, no new products in the past year, no overseas showroom, agents, branches, or offline trade-show participation, and only five employees. Quality assurance and related procedures are stated, but several procedures lack written records or completed assessment records. Financial-related entries identify years but provide no assessable financial results. Customer cases are not explicitly documented, although OEM service for well-known brands is claimed.
Supplier typeThe supplier is a limited company with five employees and no stated parent-group affiliation. Its business focuses on R&D, production, sales, and technical services for electronic and industrial adhesives, supported by a production base and laboratory in Shenzhen.
R&D capabilityThe supplier describes independent R&D, formula innovation, process improvement, application development, a professional R&D laboratory, and rapid prototyping support. However, it reports no available SDK and no new products during the past year, creating a documented limitation despite its broader R&D claims.
Production capacityThe supplier states that it operates standardized production lines and a modern production base with testing instruments and quality management systems. It also claims support for small-batch trial production and large-scale delivery, which is direct evidence of production capability.
Customization capabilityThe supplier explicitly provides ODM services and supports rapid prototyping, small-batch trial production, process optimization, and mass-production applications. These capabilities directly support customized adhesive development and production.
Product Q&A
Q:What type of adhesive is TAILE 6308(H500-1)? Is it two-part glue?
A:
It is latent one-component heat curing epoxy paste adhesive, no A&B mixing required. Direct dispensing after full stirring, only activated and cured under heating condition.
Q:What materials can this epoxy bond firmly? Main application?
A:
Perfect adhesion on MnZn / NiZn ferrite core, iron core, aluminum, copper and all metal substrates.
Main applications: EE/EP power transformer air gap filling, power inductor & common mode choke magnetic core fixing, coil component sealing, small electronic parts insulation bonding.
Q:What is the continuous working temperature range after curing?
A:
Long-term service temperature: -40c ~ 150c, withstand rapid high-low temperature thermal shock without cracking or delamination.
Q:Why does glue sag / flow down during heating curing?
A:
6308 (H500-1) has thixotropy index 5.0 with anti-sagging feature. Sagging usually caused by:
Glue not fully stirred before use, filler separation reduces thixotropy
Workpiece not placed horizontally during baking
Excessive dispensing volume, ultra-thick glue layer
Solution: Stir evenly, place parts horizontally, control glue thickness reasonably.
Q:Is this adhesive eco-friendly, meet international standards?
A:
Yes, fully comply with RoHS 2.0 and REACH regulations, no harmful restricted substances, safe for electronic export products.
Send Inquiry
*To:
Shenzhen Taile Glue Co., Ltd.
Shenzhen Taile Glue Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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