Can I customize color, viscosity or curing parameters?

Customization available: color (black /white/grey), viscosity, curing speed, thermal conductivity formula based on customer production requirements. We support technical formula adjustment.

High Tg ≥120℃ Low Stress 6308 (H500-1) Epoxy Paste for Metal & Ferrite Core Electronic Component Bonding

Name: High Tg ≥120℃ Low Stress 6308 (H500-1) Epoxy Paste for Metal & Ferrite Core Electronic Component Bonding
Brand: Shenzhen Taile Glue Co., Ltd.
SKU: 2321493645

Guangdong, ChinaShenzhen Taile Glue Co., Ltd.

US$26.00

100-999 Pieces

US$25.00

1,000-9,999 Pieces

US$24.00

10,000-99,999 Pieces

US$23.00

100,000+ Pieces

Sample price:US$25.00/piece.Request sample

Product profile

Customization

Available

Application

Automobile, Construction, Packing, Mnzn, Nizn Ferrite Core & Metal Housing

Bonding Function

Structural Adhesive

Model NO.

6308(H500-1)

Color

Black / White / Grey Paste

Composition

Organic Material

Morphology

Viscous Paste

Specific Gravity

1.20~1.26 G/Cm³

Thixotropy

Excellent Anti-Sagging

Storage

6 Months at -20℃ Frozen Storage; Store at 2~8℃ for

Hardness (Shore D)

60~70

Thermal Conductivity

0.6 W/M·K

Dielectric Strength

≥20 Kv/mm

Water Absorption

≤0.2%

Shear Strength

≥17 MPa

Transport Package

Carton with Bubble Wrap

Specification

1kg per can, 5kg per can; custom special packaging

Trademark

taile

Origin

China

HS Code

350610

Production Capacity

100000000

Key features

One component, no mixing, ready for dispensing directly

Excellent thixotropy, no sagging for thick layer filling

Outstanding electrical insulation, high dielectric strength

Low curing internal stress, resist cracking under thermal shock

Great adhesion to MnZn, NiZn ferrite core & metal housing

Continuous working temperature: -40c~150c

Good resistance to moisture, salt spray & humid aging

Eco-friendly formula, meet RoHS 2.0 & REACH

Company profile

High Repeat Buyers ChoiceR&D CapabilitiesQA/QC InspectorsQuality Assurance

Shenzhen Taile Glue Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2024-07-15Nearest Port: shenzhen protAverage Response Time: ≤2.76h

AI-Powered supplier vetting

SummaryThe supplier is a Shenzhen-based limited company focused on electronic and industrial adhesives, with stated R&D, standardized production, testing, and technical-service capabilities. It offers ODM and OEM services and supports prototyping, small-batch trials, and large-scale delivery. However, the supplier reports no available SDK, no new products in the past year, no overseas showroom, agents, branches, or offline trade-show participation, and only five employees. Quality assurance and related procedures are stated, but several procedures lack written records or completed assessment records. Financial-related entries identify years but provide no assessable financial results. Customer cases are not explicitly documented, although OEM service for well-known brands is claimed.

Supplier typeThe supplier is a limited company with five employees and no stated parent-group affiliation. Its business focuses on R&D, production, sales, and technical services for electronic and industrial adhesives, supported by a production base and laboratory in Shenzhen.

R&D capabilityThe supplier describes independent R&D, formula innovation, process improvement, application development, a professional R&D laboratory, and rapid prototyping support. However, it reports no available SDK and no new products during the past year, creating a documented limitation despite its broader R&D claims.

Production capacityThe supplier states that it operates standardized production lines and a modern production base with testing instruments and quality management systems. It also claims support for small-batch trial production and large-scale delivery, which is direct evidence of production capability.

Customization capabilityThe supplier explicitly provides ODM services and supports rapid prototyping, small-batch trial production, process optimization, and mass-production applications. These capabilities directly support customized adhesive development and production.

Product Q&A

Q:What type of adhesive is TAILE 6308(H500-1)? Is it two-part glue?

It is latent one-component heat curing epoxy paste adhesive, no A&B mixing required. Direct dispensing after full stirring, only activated and cured under heating condition.

Q:What materials can this epoxy bond firmly? Main application?

Perfect adhesion on MnZn / NiZn ferrite core, iron core, aluminum, copper and all metal substrates. Main applications: EE/EP power transformer air gap filling, power inductor & common mode choke magnetic core fixing, coil component sealing, small electronic parts insulation bonding.

Q:What is the continuous working temperature range after curing?

Long-term service temperature: -40c ~ 150c, withstand rapid high-low temperature thermal shock without cracking or delamination.

Q:Why does glue sag / flow down during heating curing?

6308 (H500-1) has thixotropy index 5.0 with anti-sagging feature. Sagging usually caused by: Glue not fully stirred before use, filler separation reduces thixotropy Workpiece not placed horizontally during baking Excessive dispensing volume, ultra-thick glue layer Solution: Stir evenly, place parts horizontally, control glue thickness reasonably.

Q:Is this adhesive eco-friendly, meet international standards?

Yes, fully comply with RoHS 2.0 and REACH regulations, no harmful restricted substances, safe for electronic export products.