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Hydrolyzable UV Glue for Glass CNC Cutting Grinding Temporary Holding
US$11.00
10-49 Pieces
US$9.00
50-99 Pieces
US$8.00
100-999 Pieces
US$7.20
1,000+ Pieces
Sample price:US$10.50/piece.Request sample
Product profile
Customization
AvailableApplication
Semiconductor, Electronic, Glass ProcessingBonding Function
Temporary Bonding, Tack-Reducing, Peelable ProtectModel NO.
3011Color
Colorless TransparentComposition
Organic MaterialMorphology
LiquidForm
Transparent LiquidViscosity(25℃)
300~500 MPa·SCuring Type
UV LED CuringCuring Wavelength
365-395 nmUV Energy Required
300-600mJ/cm²Hardness(Shore D)
50~55DHydrolysis Condition
90-100℃ Boiling Water, 2-10 minCompliance
RoHS, Reach CompliantShelf Life
3 months ( -5~20℃ sealed storage)Characteristic
Hydrolyzable, HF Resistance, Temporary FixingSubstrate
GlassWater Absorption(45℃,24h)
60~80%Transport Package
Carton with Bubble WrapSpecification
50mlTrademark
TAILEOrigin
ChinaHS Code
350610Production Capacity
100000000Key features
Stable pressure-sensitive adhesion before UV irradiation, firmly hold workpieces to avoid shifting during precision processing
Specially formulated for high-cleanliness semiconductor industry. After debonding, no adhesive residue remains on the wafer surface, no extra cleaning procedure required, effectively improving product
Uniform ultra-thin coating:Well-adjusted fluidity, support blade coating, roll coating and dispensing.no sagging, no glue accumulation, suitable for ultra-thin wafer manufacturing.
Complete de-tack reaction under low UV energy avoid high-energy UV damaging precision substrates such as silicon wafer.
Cured adhesive layer is flexible, will not scratch, crack or deform thin silicon wafers, optical films during peeling.
No yellowing after curing, resistant to mild humidity and thermal aging, stable performance in cleanroom environment.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2024-07-15Nearest Port: shenzhen protAverage Response Time: ≤1.38h
AI-Powered supplier vetting
SummaryThe supplier is a Shenzhen-based limited company focused on electronic and industrial adhesives, with stated R&D, standardized production, testing, and technical-service capabilities. It offers ODM and OEM services and supports prototyping, small-batch trials, and large-scale delivery. However, the supplier reports no available SDK, no new products in the past year, no overseas showroom, agents, branches, or offline trade-show participation, and only five employees. Quality assurance and related procedures are stated, but several procedures lack written records or completed assessment records. Financial-related entries identify years but provide no assessable financial results. Customer cases are not explicitly documented, although OEM service for well-known brands is claimed.
Supplier typeThe supplier is a limited company with five employees and no stated parent-group affiliation. Its business focuses on R&D, production, sales, and technical services for electronic and industrial adhesives, supported by a production base and laboratory in Shenzhen.
R&D capabilityThe supplier describes independent R&D, formula innovation, process improvement, application development, a professional R&D laboratory, and rapid prototyping support. However, it reports no available SDK and no new products during the past year, creating a documented limitation despite its broader R&D claims.
Production capacityThe supplier states that it operates standardized production lines and a modern production base with testing instruments and quality management systems. It also claims support for small-batch trial production and large-scale delivery, which is direct evidence of production capability.
Customization capabilityThe supplier explicitly provides ODM services and supports rapid prototyping, small-batch trial production, process optimization, and mass-production applications. These capabilities directly support customized adhesive development and production.
Product Q&A
Q:How to cure this adhesive?
A:
It is one-component UV LED curable glue. Cure under 365~395nm UV LED lamp, required UV energy: 300-600 mJ/cm2.
Q:How to remove the glue after processing?
A:
Soak bonded parts in 90~100 boiling water for 2~10 minutes. The adhesive will hydrolyze and peel off automatically. No strong acid or solvent needed.
Q:What substrate can it bond?
A:
Mainly for glass. It has good resistance to HF etching liquid during glass processing.
Q:What is 3808(3011)-1A used for?
A:
It is a temporary fixing UV adhesive specially developed for glass manufacturing. It can bond glass firmly during thinning, etching and polishing processes, and can be debonded later in hot water without scratching glass surface.
Q:Can I get samples?
A:
Yes, 50ml sample bottles are available. Sample price is different from bulk price. Contact us for quotation.
Send Inquiry
*To:
Shenzhen Taile Glue Co., Ltd.
Shenzhen Taile Glue Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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