No Residue After Stripping Low Contamination 3808-2 UV Debonding Glue for Precision Component Processing

Name: No Residue After Stripping Low Contamination 3808-2 UV Debonding Glue for Precision Component Processing
Brand: Shenzhen Taile Glue Co., Ltd.
SKU: 2322471045

Guangdong, ChinaShenzhen Taile Glue Co., Ltd.

US$42.00

10-99 Pieces

US$36.00

100-999 Pieces

US$31.00

1,000-9,999 Pieces

US$28.00

10,000+ Pieces

Sample price:US$40.00/piece.Request sample

Product profile

Customization

Available

Application

Semiconductor,Optical Materials,New Energy & Micro

Bonding Function

Structural Adhesive

Model NO.

3808-2

Color

Clear

Composition

Organic Material

Morphology

Solvent

Form

Transparent Liquid

Viscosity(25℃)

800~1500 MPa·S

Solid Content

50%

Curing Wavelength

365 Nm UV Light

Standard UV Energy

100 Mj/Cm²

Controllable Dry Film Thickness

10~30 μm

Operating Temperature

-20℃ ~ 60℃

Compliance

RoHS, Reach Compliant

Transport Package

Carton with Bubble Wrap

Specification

500g aluminum bottle

Trademark

taile

Origin

China

HS Code

350610

Production Capacity

100000000

Key features

Stable pressure-sensitive adhesion before UV irradiation, firmly hold workpieces to avoid shifting during precision processing; after 365nm UV exposure, th

Specially formulated for high-cleanliness semiconductor industry. After debonding, no adhesive residue remains on the wafer surface, no extra cleaning procedure required, effectively improving product

Uniform ultra-thin coating:Well-adjusted fluidity, support blade coating, roll coating and dispensing.no sagging, no glue accumulation, suitable for ultra-thin wafer manufacturing.

Complete de-tack reaction under low UV energy avoid high-energy UV damaging precision substrates such as silicon wafer.

Cured adhesive layer is flexible, will not scratch, crack or deform thin silicon wafers, optical films during peeling.

No yellowing after curing, resistant to mild humidity and thermal aging, stable performance in cleanroom environment.

Company profile

High Repeat Buyers ChoiceR&D CapabilitiesQA/QC InspectorsQuality Assurance

Shenzhen Taile Glue Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2024-07-15Nearest Port: shenzhen protAverage Response Time: ≤1.94h

AI-Powered supplier vetting

SummaryThe supplier is a Shenzhen-based limited company focused on electronic and industrial adhesives, with stated R&D, standardized production, testing, and technical-service capabilities. It offers ODM and OEM services and supports prototyping, small-batch trials, and large-scale delivery. However, the supplier reports no available SDK, no new products in the past year, no overseas showroom, agents, branches, or offline trade-show participation, and only five employees. Quality assurance and related procedures are stated, but several procedures lack written records or completed assessment records. Financial-related entries identify years but provide no assessable financial results. Customer cases are not explicitly documented, although OEM service for well-known brands is claimed.

Supplier typeThe supplier is a limited company with five employees and no stated parent-group affiliation. Its business focuses on R&D, production, sales, and technical services for electronic and industrial adhesives, supported by a production base and laboratory in Shenzhen.

R&D capabilityThe supplier describes independent R&D, formula innovation, process improvement, application development, a professional R&D laboratory, and rapid prototyping support. However, it reports no available SDK and no new products during the past year, creating a documented limitation despite its broader R&D claims.

Production capacityThe supplier states that it operates standardized production lines and a modern production base with testing instruments and quality management systems. It also claims support for small-batch trial production and large-scale delivery, which is direct evidence of production capability.

Customization capabilityThe supplier explicitly provides ODM services and supports rapid prototyping, small-batch trial production, process optimization, and mass-production applications. These capabilities directly support customized adhesive development and production.

Product Q&A

Q:What is the difference between this UV de-tack adhesive and ordinary UV pressure sensitive glue?

This adhesive features controllable stepwise adhesion. Before UV irradiation, enabling easy peeling with zero residue. Common UV PSA maintains constant tack after curing and cannot realize low-force residue-free stripping for high-precision semiconductor processes.

Q:Can 3808-2 work for ultra-thin silicon wafer processing?

Yes. The cured glue layer is soft and elastic without hard extrusion damage to thin wafers. uniform thin coating without sagging or glue accumulation. It will not scratch or crack silicon substrates during peeling, perfectly matching wafer thinning, grinding and dicing procedures.

Q:Why there is residual glue left on wafer after peeling? How to solve it?

Two main causes: 1. UV curing energy lower than standard 100, incomplete de-tack reaction; 2. Coating insufficient UV penetration. Solutions: Adjust UV lamp energy to 100 at 365nm wavelength; strictly control dry film thickness ; leave 3~5 minutes standing after UV exposure before peeling.

Q:What storage requirements does 3808-2 have and how long is the shelf life?

Seal and store in dark environment at 5~25, keep away from UV light, high temperature and oxidants. Unopened original bottle shelf life is 12 months. Once opened, finish use within 1 month and seal tightly away from light to avoid premature curing and failure.

Q:Is 3808-2 environmentally compliant for export to Europe and US? Does it support sample testing?

The product complies with RoHS 2.0 and REACH standards, free of heavy metals and halogens, low VOC, no substrate corrosion. We supply complete TDS, MSDS and third-party environmental test reports. Free test samples (500g standard packaging) are available for customers to verify process adaptability before mass production.