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Thermally Conductive Insulating Silicone Potting Compound for Automotive Electronic Module Protection
US$7.80
1,000-1,999 kg
US$7.00
2,000-4,999 kg
US$6.40
5,000-9,999 kg
US$6.00
10,000+ kg
Sample price:US$8.00/kg.Request sample

Product profile

Customization

Available

Application

Automobile, Packing, Precision Sensor Industry

Bonding Function

Liquid Sealing Leak

Model NO.

6821(589)

Color

Clear

Composition

Organic Material

Morphology

Solvent

Viscosity of Single a/B Component

550~750 Cps

Viscosity After Mixing

550~750 Cps

Working Time (25℃)

15~20 Min

Hardness After Curing

Shore a 7~15 (Ultra-Soft Gel)

Breakdown Voltage

≥13 Kv/mm

Dielectric Constant (60Hz)

≤4.0

Long-Term Temperature Resistance Range

-50℃ ~ 200℃

Environmental Standards

RoHS and Reach Compliant

Curing Method

Room Temperature Curing / Heat-Accelerated Curing

Shelf Life

12 Months Unopened at ≤30℃

Hazard Classification

Non-Hazardous, Non-Toxic, Transportable by Sea, Ai

Specification

1kg per set,16kg per set,37kg per Custom Packaging

Trademark

taile

Origin

Shenzhen, China

HS Code

350610

Key features

Ultra-Soft Low-Stress Protection: Shore A 7-15 hardness ideal for fragile sensors and MEMS chips to prevent thermal drift.
Zero Corrosion Addition Curing: Releases no small molecules during cure, ensuring zero corrosion to precision circuits.
RoHS & REACH Compliant: Environmentally safe, non-hazardous, and non-toxic for global market compliance.
Dual Curing Flexibility: Compatible with room temperature curing or heat-accelerated curing for various production lines.
Self-Leveling Low Viscosity: 550-750 cps viscosity ensures complete filling of micro-gaps without voids.
Transparent Inspection Capability: Clear gel allows visual calibration and inspection of protected components after curing.

Company profile

High Repeat Buyers ChoiceR&D CapabilitiesQA/QC InspectorsQuality Assurance
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc.Export Year: 2024-07-15Nearest Port: shenzhen protAverage Response Time: ≤2.81h

AI-Powered supplier vetting

SummaryThe supplier is a Shenzhen-based limited company focused on electronic and industrial adhesives, with stated R&D, standardized production, testing, and technical-service capabilities. It offers ODM and OEM services and supports prototyping, small-batch trials, and large-scale delivery. However, the supplier reports no available SDK, no new products in the past year, no overseas showroom, agents, branches, or offline trade-show participation, and only five employees. Quality assurance and related procedures are stated, but several procedures lack written records or completed assessment records. Financial-related entries identify years but provide no assessable financial results. Customer cases are not explicitly documented, although OEM service for well-known brands is claimed.
Supplier typeThe supplier is a limited company with five employees and no stated parent-group affiliation. Its business focuses on R&D, production, sales, and technical services for electronic and industrial adhesives, supported by a production base and laboratory in Shenzhen.
R&D capabilityThe supplier describes independent R&D, formula innovation, process improvement, application development, a professional R&D laboratory, and rapid prototyping support. However, it reports no available SDK and no new products during the past year, creating a documented limitation despite its broader R&D claims.
Production capacityThe supplier states that it operates standardized production lines and a modern production base with testing instruments and quality management systems. It also claims support for small-batch trial production and large-scale delivery, which is direct evidence of production capability.
Customization capabilityThe supplier explicitly provides ODM services and supports rapid prototyping, small-batch trial production, process optimization, and mass-production applications. These capabilities directly support customized adhesive development and production.

Product Q&A

Q:What's the difference between 6821 (589) and 6821?
A:
6821 (589) is a clear ultra-soft gel without thermal conductivity, only for insulation and moisture protection of fragile chips/sensors. Standard 6821 is grey thermally conductive gel (0.7W/m-K), designed for heat-dissipating power supplies and inductors.
Q:The cured gel is very soft, will it lack structural support?
A:
This gel is engineered for low-stress shock absorption of delicate components. Choose thermal conductive 6821 or epoxy potting compound if structural support is required.
Q:Why the mixed gel remains sticky and incomplete curing after cure?
A:
Substrate surface contains sulfur, amine, flux, organotin which causes catalyst poisoning; cross-contamination of A/B mixing tools; mixing different batches of Part A and B. Sample compatibility test required before mass production.
Q:Will the clear gel turn yellow under long-term outdoor UV exposure?
A:
Standard formula resists yellowing under normal solar and automotive outdoor conditions. Custom UV-resistant formula available for strong long-term UV exposure.
Q:Is it compatible with automatic dispensing and potting assembly lines?
A:
Low viscosity self-leveling formula works well with automatic dispensing machines, best performance with vacuum defoamer. Heat accelerated curing shortens cycle time for high-speed mass lines.

Send Inquiry

*To:Shenzhen Taile Glue Co., Ltd.
*Content:
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