Advanced 4G Tdd/FDD Dual-Carrier Baseband Board

Name: Advanced 4G Tdd/FDD Dual-Carrier Baseband Board
Brand: Shenzhen Tongchuang Xin Electronic Circuit Co., Ltd
SKU: 2235858045

Guangdong, ChinaShenzhen Tongchuang Xin Electronic Circuit Co., Ltd

US$880.00-1,500.00

1 Piece

Sample price:US$900.00/piece.Request sample

Product profile

Customization

Available

Dielectric

SIC

Transport Package

Carton Packing

Specification

45*68*36

Trademark

hjt

Origin

China

Production Capacity

50000/Year

Company profile

Fast DeliveryQuality AssuranceR&D Capabilities100% Finished Products Inspection

Shenzhen Tongchuang Xin Electronic Circuit Co., Ltd

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shenzhen Yiantian PortAverage Response Time: ≤24h

AI-Powered supplier vetting

SummaryThe supplier is a combined company with a focus on quality and service, offering a variety of design and customization options. They hold several certifications including ISO 9001 and ISO 14001, indicating a commitment to quality and environmental management. Their financial credibility is unclear, with some data missing for environmental sustainability. The supplier is proficient in R&D with the capability to provide 3D software design services. Production capacity seems limited with only two production lines and a lack of ongoing volume reconciliation. Customization services are extensive, but traceability in quality control is lacking.

CertificationsThe supplier holds several key certifications: ISO 14001, ISO 9001, ISO 20000, and QC 080000, indicating a strong management system.

After-Sales capabilityR&D engineers are responsible for providing technical support for production and after-sales service, suggesting a structured approach.

R&D capabilityThe supplier offers robust R&D capabilities, including 3D design services and SDK availability, indicating strong innovation potential.

Customization capabilityExtensive customization services are offered, including full and flexible customization options.