1-32 Layer PCB Support: Full capability for 1 to 32-layer PCB assembly with all stack-up configurations.
Ultra-Fine Pitch BGA: Precision BGA placement with 0.35mm center-to-center spacing and X-ray inspection.
Comprehensive Quality Control: Multi-stage inspection including SPI, AOI, X-ray, and 100% visual inspection.
Turnkey Assembly Service: Complete solutions from prototype to mass production including sourcing and assembly.
No MOQ Requirement: Flexible order volume with no minimum quantity limits for most services.
Customized Thickness: No limit on PCB thickness to meet specific design requirements.
Advanced Special Processes: Support for gold fingers, castellated holes, edge plating, and conformal coating.
Fast Lead Time: Flexible build time ranging from 7 to 35 days depending on complexity.