Full Turnkey PCBA Service: Comprehensive assembly from prototype to mass production with SMT and Thru-Hole capabilities.
1-32 Layer Multilayer Support: Accommodates all stack-up configurations and any board thickness for complex designs.
Ultra-Fine Pitch BGA Assembly: Precision placement down to 0.35mm BGA pitch with X-ray inspection for hidden joint integrity.
Comprehensive Quality Assurance: Multi-stage inspection including SPI, AOI, X-ray, and 100% visual inspection for zero defects.
Flexible Customization Options: No limits on thickness, order volume, or layer stackup with full customization from designs.
Value-Added Special Processes: Includes conformal coating, PCBA potting, and functional testing for environmental and vibration resistance.
Fast Lead Time: Flexible build time ranging from 7 to 35 days to meet urgent prototype or high-volume needs.
No Minimum Order Quantity: Accepts prototype orders starting from 5 pieces with no strict MOQ requirements for assembly.