1-32 Layer PCB Support: Full capability for 1 to 32-layer PCB assembly with all stack-up configurations.
Ultra-Fine Pitch BGA: Precision BGA placement with 0.35mm center-to-center spacing and X-ray inspection.
Comprehensive Quality Control: Multi-stage inspection including SPI, AOI, X-ray, and 100% visual inspection.
Turnkey Assembly Service: Complete solutions from PCB manufacturing to assembly, testing, and conformal coating.
No Minimum Order Quantity: Flexible production for prototypes and mass production with no MOQ limits.
Customizable Specifications: No limit on thickness, layer stackup, and order volume to meet specific needs.
Fast Lead Time: Flexible build time ranging from 7 to 35 days depending on component availability.
Advanced Testing Capabilities: Includes ICT, functional testing, aging test, and thermal shock testing.