Multi-Layer Capability: Supports 1 to 32 layers for complex rigid PCB assembly needs.
Precision Component Placement: Handles 01005 packages and fine-pitch ICs down to 0.3mm pitch.
Comprehensive Quality Testing: Includes AOI, X-Ray, ICT, and functional testing for reliability.
Wide Material Selection: Offers FR-4, Aluminum-Core, Copper-Core, and RF PCB materials.
Customizable Soldermask: Available in Green, Purple, Red, Yellow, Blue, White, and Black.
Turnkey Assembly Service: Provides full service from prototype to high-volume production.
ISO Certified Facility: Operates under ISO9001:2015 and IATF16949 standards.