Advanced SMT & Through-Hole Assembly: Capable of handling complex components including BGA, uBGA, QFN, POP, and 01005 packages with 0.3mm pitch precision.
Comprehensive Quality Testing: Includes AOI, X-Ray, ICT, functional testing, and IC programming to ensure reliability.
Wide Specification Range: Supports 1-32 layers, thickness 0.4-4.5mm, and various materials like FR-4, Aluminum, and Copper cores.
Customizable Surface Finish: Options include HASL (Leaded/Lead-Free), ENIG, and OSP for different board requirements.
Global Component Sourcing: Parts sourced from major authorized distributors with full traceability via ERP and MES systems.
ISO and IPC Certified: Facility holds ISO9001, ISO13485, and complies with IPC-A-600 and IPC-A-610 standards.
Flexible Customization Options: Offers full, minor, and flexible customization from samples or designs for unique needs.