1-32 Layer Capability: Supports full multilayer PCB assembly from 1 to 32 layers with all stack-up configurations.
Ultra-Fine Pitch BGA: Precision placement down to 0.35mm BGA pitch with X-ray inspection for hidden joint integrity.
Comprehensive Quality Control: Includes SPI, AOI, X-ray, and 100% visual inspection to ensure zero-defect delivery.
Flexible Customization: Offers full customization for thickness, layer stackup, and order volume with no limits.
Turnkey Assembly Service: Complete solutions from prototype to mass production including sourcing, assembly, and testing.
Value-Added Services: Provides conformal coating, PCBA potting, and functional testing under one roof.
Fast Lead Time: Flexible build time ranging from 7 to 35 days depending on component availability.
Industry Certifications: Certified with IATF16949, ISO9001, ISO13485, QC08000, ISO45001, and Apple MFI.