Multi-Layer Capability: Supports 1 to 32 layers with controlled impedance up to 32 layers.
Precision Component Placement: Handles 01005 packages and fine-pitch ICs with 0.3mm pitch accuracy.
Comprehensive Quality Testing: Includes AOI, X-Ray, ICT, functional testing, and microsection analysis.
Wide Material Options: Available in FR-4, Aluminum-Core, Copper-Core, and RF PCB materials.
Customizable Surface Finish: Offers HASL, ENIG, and OSP finishes in various colors including green, purple, and black.
ISO Certified Facility: Operates under ISO9001:2015 and IATF16949 standards for consistent quality.
Turnkey Assembly Service: Provides full service from design verification to mass production with component sourcing.