Advanced SMT & Thd Assembly: Supports BGA, uBGA, QFN, POP, and 01005 packages with 0.3mm pitch precision.
Comprehensive Quality Testing: Includes AOI, X-Ray, ICT, functional testing, and IC programming services.
Wide Material Options: Supports FR-4, Aluminum-Core, Copper-Core, and RF PCB materials.
Flexible Layer Count: Manufactures 1 to 32 layers with controlled impedance options.
Diverse Surface Finishes: Offers HASL, ENIG, and OSP finishes in multiple soldermask colors.
ISO & IPC Certified: Complies with IPC-A-600, IPC-A-610, ISO9001, and IATF 16949 standards.
Turnkey & Consigned Service: Provides full turnkey solutions or customer-provided component services.