Advanced Component Placement: Capable of placing 01005 passive components and fine-pitch ICs with 0.3mm pitch accuracy.
Comprehensive Quality Testing: Includes AOI, X-Ray, ICT, functional testing, and IC programming for reliability.
Wide Specification Range: Supports copper weights 0.5oz-12oz, thickness 0.2-10mm, and track widths down to 0.065mm.
ISO and IPC Certified: Complies with IPC-A-600, IPC-A-610, ISO9001, IATF16949, and other industry standards.
Flexible Customization: Offers full customization, minor customization, and flexible options from samples or designs.
Reliable Component Sourcing: Parts sourced from authorized distributors with full traceability via ERP and MES systems.
Multi-Layer Capability: Specializes in multilayer PCB assembly ranging from 1 to 32 layers for complex applications.