Qbip-1900at 3.5 Sub Compact Wide Embedded Motherboard with Intel Celeron J1900 Processor DDR3l for Gigabyte

Name: Qbip-1900at 3.5 Sub Compact Wide Embedded Motherboard with Intel Celeron J1900 Processor DDR3l for Gigabyte
Brand: Beijing Teket Innovation Technology Company Limited
SKU: 2077655602

Beijing, ChinaBeijing Teket Innovation Technology Company Limited

US$150.00-350.00

1 unit

Product profile

Customization

Available

Integrated Graphics

Main Chipset

Intel

Model NO.

QBiP-1900AT

Maximum Memory Capacity

Structure

3.5'' Sbc

Memory

DDR3

SATA Interface

SATA3.0

Printed Circuit Board

Double Layers

Main Board Structure

Integrated

Audio Effects

Not HiFi

with CPU

Yes

Chipset

Other

Fsb/Ht

2400

Socket Type

Onboard CPU

CPU Type

Intel

Aunch Date

2018

Hard Drive Interface

SATA

Item Condition

New

Memory Channel

Double

Products Status

New

Private Mold

Yes

Application

Server/Workstation

Transport Package

Std

Specification

375 x 324 x 293 (mm)

Trademark

Gigabyte

Origin

Bj, Cn

Production Capacity

1000pieces Per Year

Company profile

Beijing Teket Innovation Technology Company Limited

Beijing, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 20 Years CertifiedNearest Port: Beijing Port, Tianjin PortAverage Response Time: ≤10.50h

AI-Powered supplier vetting

SummaryThe supplier specializes in customization services with strong R&D capabilities, offering ODM services and having released new products in the past year. Despite a comprehensive service capability, it lacks overseas infrastructure like warehouses and showrooms, and has limited export experience with only seven staff. Quality control and complaint handling processes are robust, but the supplier does not participate in offline trade shows. Financial data is provided for the last three years, but no specific certifications are mentioned.

After-Sales capabilityThe supplier has clear procedures for handling customer complaints and service capability assessment.

Financial creditFinancial data is available for the past three years, indicating transparency in financial reporting.

R&D capabilityThe supplier has recently developed new products and offers ODM services but lacks an SDK.

Customization capabilityThe supplier offers extensive customization options from samples, designs, and full customization.