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Disco Dad3230 Compact Dicing Saw Automatic Precision Wafer Sawing Machine High Expandability Semiconductor Equipment
US$48,000.00-50,000.00
1 Piece
Product specifications
Product Size
Product Weight
Product profile
Customization
AvailableAfter-sales Service
YesSpecies
Die Cutting and Creasing MachineModel NO.
DAD3230Imprinting Type
PlatenComputerized
ComputerizedAutomatic Grade
AutomaticApplication
Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating MaterialsMachine Type
Semi-Automatic Dicing SawMax. Workpiece Size
200mm (8-Inch) / Square up to 200X200mmSpindle Power
1.8 Kw (Standard, High Torque Option Available)Spindle Speed
6,000 ~ 60,000 Rpm (Variable Frequency Control)Cutting Speed
up to 600 mm/S (X-Axis Feed Speed)Vision System
High-Resolution CCD (Expandable with Auto Focus/AlTransport Package
Wooden CaseTrademark
DISCOOrigin
USAHS Code
8479896200Key features
Compact & Space-Saving Design: Ideal for cleanrooms or labs with limited floor space, minimizing operational footprint.
Unmatched Expandability: Supports optional modules including advanced vision systems, high-torque spindles, and varied chuck tables.
High Precision & Reliability: Leverages air-bearing spindle technology for clean cuts with minimal chipping on fragile materials.
Versatile Material Compatibility: Processes standard IC wafers, LED substrates, SiC, GaN, and hard ceramic substrates.
High-Speed Variable Frequency Control: Spindle speed ranges from 6,000 to 60,000 Rpm with up to 600 mm/S feed speed.
High-Resolution Vision System: Equipped with CCD vision system, expandable with auto-focus and automatic alignment.
Comprehensive After-Sales Service: Includes technical consultation, installation, training, and maintenance by experienced professionals.
OEM and ODM Services Available: Offers full customization, minor customization, and flexible customization from samples or designs.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.99hTerms of Payment: LC, T/T, D/P, etc.
AI-Powered supplier vetting
SummaryThe supplier is identified as a factory in Bao’an District, Shenzhen, serving the SMT and semiconductor equipment sector. It provides SMT spare parts, consumables, equipment maintenance, calibration, precision processing, jigs, and automated non-standard products. Evidence supports customization services, OEM service for popular brands, documented complaint and corrective-action procedures, and stated lead times of within 15 working days in both peak and off-peak seasons. However, the supplier has no stated supplier-management certification, no in-stock or overseas warehouse capability, no overseas showroom, no available SDK, no new products launched in the past year, and only one R&D engineer reported. Raw-material traceability and quality assurance status are unknown. Customer references are not specifically disclosed, although the company states it serves SMT and semiconductor industry customers nationwide.
Supplier typeThe supplier is identified as a factory located in Shenzhen’s Bao’an District, with business activities spanning SMT equipment and consumables, precision processing, jigs, automation products, and electronic products. Its stated domestic sales network and industrial-equipment focus support classification as a manufacturing-oriented industrial supplier.
CertificationsThe supplier-management-system certification field is explicitly recorded as NIL. No certification evidence is provided, so the supplier does not demonstrate an advantage in this field.
After-Sales capabilityThe supplier provides equipment relocation, maintenance, care, and precision calibration services, including maintenance of feeders, placement heads, boards, drivers, motors, and cameras. It also reports documented and followed procedures for customer complaints, corrective and preventive actions, and supplier-service assessment, with stated service lead times within 15 working days in both peak and off-peak seasons.
R&D capabilityThe supplier reports no new products launched during the past year and no available SDK. It does conduct R&D for automated non-standard products and electronic products, but only one total R&D engineer is reported, limiting evidence of strong innovation capacity.
Production capacityThe supplier operates as a factory with a 600.0 m² manufacturing plant and offers precision parts processing, jig production, automated non-standard products, and SMT-related services. It reports 80 qualified service suppliers and documented supplier-assessment procedures, but has no in-stock capacity and its outsourcing procedures and manufacturing contracts are unknown.
Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, minor customization, and flexible customization. Its precision-processing, jig-design, and automated non-standard-product activities further support the stated customization capability.
Product Q&A
Q:What is the maximum workpiece size?
A:
The machine supports a maximum workpiece size of 200mm (8-Inch) or square up to 200x200mm.
Q:Can the spindle speed be adjusted?
A:
Yes, the spindle speed is variable frequency controlled, ranging from 6,000 to 60,000 Rpm.
Q:Is the machine suitable for SiC and GaN materials?
A:
Yes, it is engineered to dice various materials including standard silicon wafers, Silicon Carbide (SiC), and Gallium Nitride (GaN).
Q:What customization options are available?
A:
We offer full customization, minor customization, and flexible customization based on samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Send Inquiry
*To:
Shenzhen Tengxiangjia Technology Co., Ltd.
Shenzhen Tengxiangjia Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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