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Chip Packaging Compact Soldering System with Water Cooling R&D RS220
US$36,400.00-48,900.00
1 Piece
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Chip Packaging Compact Soldering System with Water Cooling R&D RS220
Beijing, China
Termway (Beijing) Precision Technology Co., Ltd.
Chip Packaging Compact Soldering System with Water Cooling R&D RS220
US$36,400.00-48,900.00
1 Piece
Chat now
Send inquiry
Product profile
After-sales Service
Engineer Online or at Site
Condition
New
Certification
ISO, CE
Model NO.
RS220
Warranty
12 Months
Automatic Grade
Semiautomatic
Installation
Vertical
Name
Vacuum Reflow Oven
Heating Plate
Graphite
Soldering Area
220mm*220mm
Chamber Height
100mm
Atmosphere
Nitrogen
Liquid
Formic Acid
Vacuum
10-1PA
Temperature
450c (Higher Is Optional)
Uniformity
+-2%C
Heating Rate
120c/Minute
Cooling Way
Nitrogen/ Water-Cooling (Shell, Heating Plate)
Cooling Rate
120c/Minute
Voltage
220V 63A
Transport Package
Wooden Case
Specification
94*84*162cm
Trademark
TORCH
Origin
Beijing, China
HS Code
8514101000
Production Capacity
100 Sets / Year
Key features
Ultra-Low Void Rate: Minimizes solder void rate to 1%, significantly lower than the industry average of 20%.
Advanced Vacuum Control: Achieves vacuum levels up to 10^-1 Pa using a mechanical vacuum pump.
Multi-Atmosphere Capability: Supports vacuum, nitrogen, and reducing atmospheres (formic acid) via MFC control.
Flexible Process Software: 40-stage programmable curves with real-time monitoring and analysis functions.
Customizable Chamber Height: Standard 100mm height with optional customization for other heights.
Comprehensive Safety Protection: Features anti-error interlocking, over-temperature, over-pressure, and time-out alarms.
Company profile
Termway (Beijing) Precision Technology Co., Ltd.
Beijing, China
Certified
Business Type: Manufacturer/Factory & Trading Company
Export Year: 2012-04-10
Certified
Nearest Port: Tianjin Port
Average Response Time: >24h
Certified
Terms of Payment: LC, T/T
Certified
International Commercial Terms(Incoterms): FOB, CIF
About Our Factory & Business Background
Address
12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing
Plant Area
1100 square meters
Number of Employees
28
Registered Capital
1,000,000 RMB
Average Lead Time
Peak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main Products
PCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Production Machines
Dial indicator, Bench driller, Multimeter, AOI tester
R&D Engineers
6 people
Own Brand
Yes
Our Industry Experience & Global Business Record
Year of Establishment
2012-07-31
Main Markets
North America, Europe, East Asia(Japan/ South Korea)
Number of Foreign Trading Staff
5
Overseas Agent/Branch
Yes
Product Q&A
Q:
What is the void rate achieved by this system?
A:
The RS220 system can minimize the void rate to 1%, which is far superior to the average 20% found in standard reflow ovens.
Q:
Can the chamber height be customized?
A:
Yes, while the standard chamber height is 100mm, other heights are available as optional customizations.
Q:
What types of atmospheres can the oven operate in?
A:
The system supports soldering under vacuum, nitrogen, and reducing atmospheres like formic acid or nitrogen-hydrogen mixtures.
Q:
Is the temperature control system customizable?
A:
Yes, the software allows up to 40 segments of programmable temperature control with 6 sets of PID settings.
Q:
What is the warranty period for this equipment?
A:
The product comes with a 12-month warranty.
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