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Desoldering Worktable BGA900-IR
US$2,599.00
1 Piece
US$2,399.00
2+ Pieces
Sample price:US$2699.00/piece.Request sample
Product profile
Type
Soldering StationStructure
PlatformRotaion Speed
0.3-3rpmModel NO.
BGA900Max Eccentricity Distance
250mmTilting Angle
0-135°Voltage
220VWelding Turning Rolls Type
AdjustableCondition
NewMax Mounting BGA Siz
≤ 20mm X20mmMin Mounting BGA Size
3.5× 3.5mmPower
200WPower Supply
220V, 50HzNet Weight
15kgDimension
400 * 550 * 430mmTransport Package
Wooden CaseSpecification
400 * 550 * 430mmTrademark
TorchOrigin
Beijing, ChinaHS Code
8514200009Production Capacity
300 Sets/YearKey features
Dual-Sided Infrared Heating: Heats components from top and PCB from bottom simultaneously for stable, even heating.
Independent Temperature Control: Separate high-precision control for top and bottom with 0.5% error margin and alarm function.
Laser Chip Orientation: Red laser system for easy and accurate centering of BGA chips.
Versatile Repair Application: Suitable for soldering, unsoldering, and repairing BGA, QFP, CSP, and semiconductor packages.
Compact Design: Small footprint fits in 400mm rooms, convenient for transport and small maintenance departments.
High Precision Sensors: High sensitive K-type temperature sensors for direct and accurate temperature monitoring.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading CompanyExport Year: 2012-04-10 CertifiedNearest Port: Tianjin PortAverage Response Time: >24h CertifiedTerms of Payment: LC, T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF
About Our Factory & Business Background
Address12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing
Plant Area1100 square meters
Number of Employees28
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsPCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Production MachinesDial indicator, Bench driller, Multimeter, AOI tester
R&D Engineers6 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2012-07-31
Main MarketsNorth America, Europe, East Asia(Japan/ South Korea)
Number of Foreign Trading Staff5
Overseas Agent/BranchYes
Product Q&A
Q:What is the heating method used?
A:
It uses dual-sided infrared ray heating, heating from the top and preheating at the bottom simultaneously.
Q:Can it handle lead-free soldering?
A:
Yes, the large area heating system is designed to meet multi-layer PCB substrate and lead-free soldering requirements.
Q:What is the maximum BGA size it supports?
A:
The maximum mounting BGA size is 20mm x 20mm, with a minimum size of 3.5mm x 3.5mm.
Q:Is the bracket adjustable?
A:
Yes, the bracket design is decided by the customer's request to ensure proper fixation of the PCB.
Q:What is the total power consumption?
A:
The total power is 900W, with 300W for top heating and 600W for bottom heating.
Send Inquiry
*To:Termway (Beijing) Precision Technology Co., Ltd.
Termway (Beijing) Precision Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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