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Heat Conductive Silicone Pad Heat Dissipation Efficiency Silicone Sheet for CPU Chips

Name: Heat Conductive Silicone Pad Heat Dissipation Efficiency Silicone Sheet for CPU Chips
Brand: GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
SKU: 2113110602

Guangdong, ChinaGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

US$0.10-5.00

100 Pieces

Sample price:US$5.00/piece.Request sample

Product profile

Customization

Available

Application

Industrial Equipment

Color

Customized

Model NO.

Thermally conductive Gap filler

Material

Silicone

Maximum Voltage

<10KV

Thermal Rating

94 V0

Thickness

Customized

Thermal Conductivity

1.0-8.0W/M-K

Density

1.9-3.4G/Cc

Hardness

50/70 Shore 00

Continuous Use Temp

-40 to 125

UL Flammability Rating

94 V0

Working Temp.

-40 to 125

Feature

Non-Silicone Oil Bleeding

Product

High Working Performance Thermally Pad

Size

Customized

Shape

Customized Die Cutting

Widely Application

Consumer Electronics , LED Lights

Hot Selling

Gap Filler Material of Thermal Conductive

Transport Package

Custom

Specification

customized

Trademark

TOUSEN

Origin

China

HS Code

35069900

Production Capacity

500000

Key features

Customizable Dimensions: Thickness and shape are fully customizable to fit specific application requirements.

Electrical Insulation: Provides low electrical conductivity to prevent short circuits in electronic systems.

Flexible and Compressible: Soft texture conforms to irregular surfaces, eliminating air gaps and reducing resistance.

Durable and Stable: Resistant to aging, chemicals, and moisture, ensuring long-term performance.

Safety Certifications: Products hold UL, CE, ROHS, and REACH certifications for global compliance.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceSelf-brandedExhibition Experience

GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2009-01-01Nearest Port: SHENZHENAverage Response Time: ≤7.79hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): CIF, DDP, CIP, Others

AI-Powered supplier vetting

SummaryGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD. is a China-based limited company and factory/trading company in Dongguan, Guangdong, specializing in thermal pads. It holds a valid import/export license, reports that 71%–90% of sales are exports, and has six years of export experience. The supplier supports multiple customization modes and has participated in the Thermal Management Expo. It reports procedures and records for corrective/preventive actions and customer complaints. However, it has no in-stock capacity, overseas warehouse, showroom, overseas agent or branch, and no SDK availability or OEM service for popular brands. The provided audit record identifies TÜV Rheinland, but does not state a certification held or a positive audit result. Innovation plans mention increased R&D investment in graphene and phase-change technologies, while current innovation performance is not sufficiently evidenced.

Supplier typeThe supplier is identified as a limited company, factory/manufacturer and trading company located in Dongguan, Guangdong, China, with 13 employees and no larger-company group affiliation. It also holds a valid import/export license.

After-Sales capabilityThe supplier has documented procedures and followed records for handling customer complaints and corrective/preventive actions. However, it reports no overseas warehouse, showroom, agent, branch, or in-stock service capacity, limiting evidence of localized after-sales support.

Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, flexible customization, and minor customization. This directly demonstrates broad stated customization coverage.

Client casesThe supplier states that it collaborates with Samsung, Huawei, Foxconn, Panasonic, and Midea. However, it separately reports no OEM service for popular brands, so the nature and scope of these collaborations are not fully clarified.