High-Density Thermal Paste PCB Heat Dissipation Insulating Thermal Grease

Name: High-Density Thermal Paste PCB Heat Dissipation Insulating Thermal Grease
Brand: GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
SKU: 2089703942

Guangdong, ChinaGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

US$0.25-150.00

1 kg

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Application Method

Customized, Customized

State

Paste, Paste

Model NO.

TSG

Filler Material

Aluminum Oxide

Type

Silicone-Based

Application

Computer

Filler Material

Aluminum Oxide

Type

Silicone-Based

Application

Computer

Certification

ISO, Reach, RoHS

Thermal Conductivity

1 ~ 12.88W/M-K

Density

2.1-3.5

Work Temp

-50 to +200

Volatile Content

1.6 ~ 1.8

Thermal Resistance

0.2 ~ 0.03

Color

Grey

Maximum Voltage

<10kv

Material

Silicone

Thermal Rating

94 V0

Transport Package

Customized

Specification

1g, 3g, 7g, 15g, 30g 1kgs, Customized

Trademark

TOUSEN

Origin

China

HS Code

35069190

Production Capacity

500t

Key features

Superior Thermal Conductivity: High thermal conductivity ensures efficient heat dissipation from CPU or GPU.

Non-Conductive & Safe: Safe for electronic components with no risk of short circuits or corrosion.

Long-Lasting Performance: Engineered for longevity, remaining effective over time without drying out.

Easy Application: Smooth and even application suitable for users of all skill levels.

Certified Quality: Products hold UL and SGS certifications, compliant with REACH and ROHS.

Customization Support: Offers OEM customization and die-cutting services for various thermal materials.

Multi-Industry Application: Ideal for CPUs, GPUs, laptops, and other electronic components requiring cooling.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceSelf-brandedExhibition Experience

GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2009-01-01Nearest Port: SHENZHENAverage Response Time: ≤0.94hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): CIF, DDP, CIP, Others

AI-Powered supplier vetting

SummaryGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD. is a China-based limited company and factory/trading company in Dongguan, Guangdong, specializing in thermal pads. It holds a valid import/export license, reports that 71%–90% of sales are exports, and has six years of export experience. The supplier supports multiple customization modes and has participated in the Thermal Management Expo. It reports procedures and records for corrective/preventive actions and customer complaints. However, it has no in-stock capacity, overseas warehouse, showroom, overseas agent or branch, and no SDK availability or OEM service for popular brands. The provided audit record identifies TÜV Rheinland, but does not state a certification held or a positive audit result. Innovation plans mention increased R&D investment in graphene and phase-change technologies, while current innovation performance is not sufficiently evidenced.

Supplier typeThe supplier is identified as a limited company, factory/manufacturer and trading company located in Dongguan, Guangdong, China, with 13 employees and no larger-company group affiliation. It also holds a valid import/export license.

After-Sales capabilityThe supplier has documented procedures and followed records for handling customer complaints and corrective/preventive actions. However, it reports no overseas warehouse, showroom, agent, branch, or in-stock service capacity, limiting evidence of localized after-sales support.

Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, flexible customization, and minor customization. This directly demonstrates broad stated customization coverage.

Client casesThe supplier states that it collaborates with Samsung, Huawei, Foxconn, Panasonic, and Midea. However, it separately reports no OEM service for popular brands, so the nature and scope of these collaborations are not fully clarified.