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High Temperature Silicon Thermal Pad Heat Conductive Gap Adhesion Pad for CPU

Name: High Temperature Silicon Thermal Pad Heat Conductive Gap Adhesion Pad for CPU
Brand: GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
SKU: 1967465832

Guangdong, ChinaGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

US$0.10-5.00

100 Pieces

Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

Material

Silicone

Application

Industrial

Model NO.

TSPAD

Certification

REACH, RoHS

Thermal Conductivity

1.0-8.0W/M-K

Thickness

0.3-14.0mm

Density

1.8-5g/Cc

Hardness

10-70 Shore C

Continuous Use Temp

-40 to 300

Breakdown Voltage

5000-7000VAC/mm

UL Flammability Rating

94 V0

Transport Package

Custom

Specification

200*400/330*300/custom

Trademark

TOUSEN

Origin

China

HS Code

35069900

Production Capacity

500000

Key features

Customizable Dimensions: Thickness can be customized from 0.3 to 14.0mm to fit specific design requirements.

Electrical Insulation Safety: Low electrical conductivity prevents short circuits, ensuring safe use in electronics.

Flexible and Compressible: Soft texture conforms to irregular surfaces, eliminating air gaps and reducing resistance.

Durable and Chemical Resistant: Resistant to aging, chemicals, and moisture, ensuring long-term performance.

Certified Quality Standards: Products hold UL, CE, RoHS, REACH certifications and ISO management system approvals.

Die-Cut Customization Service: Provides die-cutting services according to customer drawings for various shapes.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceSelf-brandedExhibition Experience

GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2009-01-01Nearest Port: SHENZHENAverage Response Time: ≤7.30hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): CIF, DDP, CIP, Others

AI-Powered supplier vetting

SummaryGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD. is a China-based limited company and factory/trading company in Dongguan, Guangdong, specializing in thermal pads. It holds a valid import/export license, reports that 71%–90% of sales are exports, and has six years of export experience. The supplier supports multiple customization modes and has participated in the Thermal Management Expo. It reports procedures and records for corrective/preventive actions and customer complaints. However, it has no in-stock capacity, overseas warehouse, showroom, overseas agent or branch, and no SDK availability or OEM service for popular brands. The provided audit record identifies TÜV Rheinland, but does not state a certification held or a positive audit result. Innovation plans mention increased R&D investment in graphene and phase-change technologies, while current innovation performance is not sufficiently evidenced.

Supplier typeThe supplier is identified as a limited company, factory/manufacturer and trading company located in Dongguan, Guangdong, China, with 13 employees and no larger-company group affiliation. It also holds a valid import/export license.

After-Sales capabilityThe supplier has documented procedures and followed records for handling customer complaints and corrective/preventive actions. However, it reports no overseas warehouse, showroom, agent, branch, or in-stock service capacity, limiting evidence of localized after-sales support.

Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, flexible customization, and minor customization. This directly demonstrates broad stated customization coverage.

Client casesThe supplier states that it collaborates with Samsung, Huawei, Foxconn, Panasonic, and Midea. However, it separately reports no OEM service for popular brands, so the nature and scope of these collaborations are not fully clarified.