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High Thermal Conductivity Phase Change Metal Sheet for CPU & Power Electronics

Name: High Thermal Conductivity Phase Change Metal Sheet for CPU & Power Electronics
Brand: GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
SKU: 2094826392

Guangdong, ChinaGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

US$3.00-12.80

100 Pieces

Sample price:US$5.00/piece.Request sample

Product profile

Customization

Available

Application

CPU Servers

Color

Bright Silver

Model NO.

TSPCM

Maximum Voltage

<10KV

Thermal Conductivity (W/M·K)

≥60W

Thermal Resistance

0.06

Thickness (mm)

0.05-0.2

Specific Heat (J/G·K)

0.31

Density (G/Cm³)

7.7

Volume Resistivity (Ω·cm)

9.7X10^-6

Phase Change Temperature (°c)

Volatility (%)

<0.001

Specification

≥ 60W

Trademark

TOUSEN

Origin

China

Key features

Phase Change Technology: Fills gaps via capillary action at low melting points to reduce thermal resistance.

Customizable Thickness: Thickness ranges from 0.05-0.2mm and is fully customizable to fit specific needs.

Eco-Friendly & Safe: Non-toxic, free from silicone oil, and complies with ROHS 2.0 standards.

Stable Properties: Maintains stability in high-temperature and high-heat flux environments.

Certified Quality: Factory certified under ISO9001, ISO14001, and IATF16949 systems.

OEM/ODM Service: Provides customized die-cutting and OEM services for global brands.

Wide Application: Ideal for CPU servers, power electronics, and new energy vehicles.

Company profile

Importers and ExportersHigh Repeat Buyers ChoiceSelf-brandedExhibition Experience

GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2009-01-01Nearest Port: SHENZHENAverage Response Time: ≤4.74hTerms of Payment: LC, T/T, D/P, etc.International Commercial Terms(Incoterms): CIF, DDP, CIP, Others

AI-Powered supplier vetting

SummaryGUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD. is a China-based limited company and factory/trading company in Dongguan, Guangdong, specializing in thermal pads. It holds a valid import/export license, reports that 71%–90% of sales are exports, and has six years of export experience. The supplier supports multiple customization modes and has participated in the Thermal Management Expo. It reports procedures and records for corrective/preventive actions and customer complaints. However, it has no in-stock capacity, overseas warehouse, showroom, overseas agent or branch, and no SDK availability or OEM service for popular brands. The provided audit record identifies TÜV Rheinland, but does not state a certification held or a positive audit result. Innovation plans mention increased R&D investment in graphene and phase-change technologies, while current innovation performance is not sufficiently evidenced.

Supplier typeThe supplier is identified as a limited company, factory/manufacturer and trading company located in Dongguan, Guangdong, China, with 13 employees and no larger-company group affiliation. It also holds a valid import/export license.

After-Sales capabilityThe supplier has documented procedures and followed records for handling customer complaints and corrective/preventive actions. However, it reports no overseas warehouse, showroom, agent, branch, or in-stock service capacity, limiting evidence of localized after-sales support.

Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, flexible customization, and minor customization. This directly demonstrates broad stated customization coverage.

Client casesThe supplier states that it collaborates with Samsung, Huawei, Foxconn, Panasonic, and Midea. However, it separately reports no OEM service for popular brands, so the nature and scope of these collaborations are not fully clarified.