Supercomputing Hpc Cluster: High-Performance Computing Chips Direct Liquid Cooling

The micro-channel serrated structure design increases the contact heat exchange area of the medium, quickly removing the heat from the heat source.

CNC integrated milling forming, with uniform flow channel distribution and sufficient water flow disturbance, fully leveraging the heat dissipation efficiency of the coolant.

Multi-layer anti-aging sealing structure, resistant to high and low temperature creep, eliminating the risk of leakage; the material is corrosion-resistant.

Under high load, the temperature remains stable, meeting the requirements for long-term full-load operation of high-power equipment.

CFD fluid simulation for iterative flow path design, to suppress local hotspots, and achieve a small temperature difference throughout the entire machine.

Reducing reliance on cooling fans, the noise level is significantly better than that of the air-cooling solution, thereby improving the operating environment of the equipment.

Standardized interface, supporting expansion of multiple heat sources for cooling, facilitating integration into complete machine equipment, and supporting customized development for non-standard proj

AI Intelligent Computing Center, GPU Server Cluster, Supercomputing HPC, Edge Computing Power Cabinet. Container energy storage power station, industrial and commercial energy storage cabinet, house

Optical fiber/semiconductor laser, high-power RF power supply, IGBT inverter, SVG, industrial power supply, welding equipment, rail transit converter. 5G/6G high-power base station, communication

MRI, nuclear magnetic resonance, CT, high-end detection instruments. High-performance industrial workstation, high-power test platform, special electronic equipment.